Approaches to Heterogeneous Integration for Millimeter-Wave Applications

A. S. Efimov
{"title":"Approaches to Heterogeneous Integration for Millimeter-Wave Applications","authors":"A. S. Efimov","doi":"10.32603/1993-8985-2023-26-4-33-55","DOIUrl":null,"url":null,"abstract":"Introduction . Enhanced performance of electronic systems can be achieved by heterogeneous integration of different semiconductor technologies. The benefits of heterogeneous integration become obvious when close connections between the devices are provided. The development of integration approaches, enabling functionality and improved performance, appears a relevant task for modern microwave microelectronics. Aim . Review of state-of-the-art and promising heterogeneous integration concepts and techniques in microwave microelectronics. Materials and methods . Eight integration approaches that ensure the connection of devices based on different semiconductor technologies for microwave frequencies are considered: monolithic heterogeneous integration, wafer bonding, micro-transfer printing, embedded chip assembly, print additive manufacturing, wire bonding, flip-chip, and hotvia. The integration approaches are analyzed in terms of their implementation specifics, advantages and disadvantages. Results . Monolithic heterogeneous integration and wafer bonding, as well as micro-transfer printing, despite the minimum interconnections, have a number of fundamental limitations. These limitations are related to the compatibility of various semiconductor technologies and the necessity of high technological capabilities. The technology of embedded chip assembly enables the variability of implementation techniques, which makes it possible to provide unique characteristics, e.g., due to the integration of magnetic materials. However, this approach is associated with a high complexity of integration technological processes. Flip-chip integration ensures minimal interconnect losses due to bump miniaturization. Hot-via, as a modification of flip-chip, provides for a better compatibility with microstrip type circuitry. Their further improvement and mass application largely depends on the development of technologies for the formation of low-pitch interconnections. Conclusion. The development of close integration approaches in microwave microelectronics is proceeding both in the monolithic direction, i.e., monolithic heterogeneous integration wafer bonding, as well as in the quasi-monolithic direction, i.e., micro-transfer printing, embedded chip assembly, print additive manufacturing, flip-chip, and hot-via. The conducted comparative analysis of the presented methods has practical application.","PeriodicalId":33242,"journal":{"name":"Izvestiia vysshikh uchebnykh zavedenii Rossii Radioelektronika","volume":"60 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Izvestiia vysshikh uchebnykh zavedenii Rossii Radioelektronika","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.32603/1993-8985-2023-26-4-33-55","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Introduction . Enhanced performance of electronic systems can be achieved by heterogeneous integration of different semiconductor technologies. The benefits of heterogeneous integration become obvious when close connections between the devices are provided. The development of integration approaches, enabling functionality and improved performance, appears a relevant task for modern microwave microelectronics. Aim . Review of state-of-the-art and promising heterogeneous integration concepts and techniques in microwave microelectronics. Materials and methods . Eight integration approaches that ensure the connection of devices based on different semiconductor technologies for microwave frequencies are considered: monolithic heterogeneous integration, wafer bonding, micro-transfer printing, embedded chip assembly, print additive manufacturing, wire bonding, flip-chip, and hotvia. The integration approaches are analyzed in terms of their implementation specifics, advantages and disadvantages. Results . Monolithic heterogeneous integration and wafer bonding, as well as micro-transfer printing, despite the minimum interconnections, have a number of fundamental limitations. These limitations are related to the compatibility of various semiconductor technologies and the necessity of high technological capabilities. The technology of embedded chip assembly enables the variability of implementation techniques, which makes it possible to provide unique characteristics, e.g., due to the integration of magnetic materials. However, this approach is associated with a high complexity of integration technological processes. Flip-chip integration ensures minimal interconnect losses due to bump miniaturization. Hot-via, as a modification of flip-chip, provides for a better compatibility with microstrip type circuitry. Their further improvement and mass application largely depends on the development of technologies for the formation of low-pitch interconnections. Conclusion. The development of close integration approaches in microwave microelectronics is proceeding both in the monolithic direction, i.e., monolithic heterogeneous integration wafer bonding, as well as in the quasi-monolithic direction, i.e., micro-transfer printing, embedded chip assembly, print additive manufacturing, flip-chip, and hot-via. The conducted comparative analysis of the presented methods has practical application.
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毫米波应用的异构集成方法
介绍。不同半导体技术的异质集成可以提高电子系统的性能。当提供设备之间的紧密连接时,异构集成的好处变得明显。集成方法的发展,使功能和改进的性能,似乎是现代微波微电子的相关任务。的目标。综述了微波微电子学中最新的和有前途的异构集成概念和技术。材料和方法。考虑了八种集成方法,确保基于不同半导体技术的器件在微波频率下的连接:单片异质集成、晶圆键合、微转移印刷、嵌入式芯片组装、打印增材制造、线键合、倒装芯片和热via。分析了各种集成方法的实现特点、优缺点。结果。单片异质集成和晶圆键合,以及微转移印刷,尽管最小的互连,有一些基本的限制。这些限制与各种半导体技术的兼容性和高技术能力的必要性有关。嵌入式芯片组装技术使实现技术的可变性成为可能,这使得它有可能提供独特的特性,例如,由于磁性材料的集成。然而,这种方法与集成技术过程的高度复杂性相关联。由于碰撞小型化,倒装芯片集成确保了最小的互连损耗。热通孔作为倒装芯片的一种改进,提供了与微带电路更好的兼容性。它们的进一步改进和大规模应用在很大程度上取决于形成低音互连的技术的发展。结论。微波微电子中紧密集成方法的发展既在单片方向上进行,即单片异质集成晶圆键合,也在准单片方向上进行,即微转移印刷,嵌入式芯片组装,打印增材制造,倒装芯片和热通孔。所提出方法的对比分析具有实际应用价值。
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33
审稿时长
8 weeks
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