Single-Length and On-Wafer Probe-Based Broadband and Rapid Characterization of Substrate Dielectric Constant for Aerospace Applications

Abstract

The space environment can exert an influence on the dielectric properties of dielectric substrates, and potential alterations in substrate dielectric constant could significantly impact the performance and reliability of spaceborne devices and systems, which might lead to mission failure. This work presents a technique for rapid and broadband characterization of substrate dielectric constant by performing only a single measurement of a single transmission line based on the ground–signal–ground (GSG) on-wafer probe for aerospace applications. Another extraction technique by the use of welding microwave connector is also discussed for comparison. Unlike previously reported techniques that require two or more transmission lines and welding connectors, our method owns the merits of avoiding connector repeatability and additional parasitic elements, easy and fast to implement without prior knowledge of substrate dielectric constant, low analysis complexity, less fabrication efforts, and being applicable to most dielectric substrates. This study offers valuable insights for airborne and spaceborne platforms with limited space, simultaneously mitigating costs and complexity, rendering it an appealing proposition for aerospace applications.