Application of soy starch as a binder in HDF technology

Abstract

Application of soy starch as a binder in HDF technology. The aim of the research was to determine the selected properties of a dry-formed high-density fibreboard (HDF) bonded with soya flour as an environmentally friendly binding agent. The scope of work included the production of boards under laboratory conditions with different mass percentages of soy flour, i.e. 10%, 12%, 15% and 20%. Different mechanical and physical properties were determined, namely modulus of rupture, modulus of elasticity, the screw withdrawal resistance of the panels, internal bonding strength, density profile, thickness swelling, water absorption and surface water absorption. The results showed that increasing the proportion of soybean binder by weight contributes to improving mechanical properties but worsens physical properties.