Special Issue: Challenges and Opportunities in Computing Research to Enable Next-Generation Engineering Applications

IF 2.6 3区 工程技术 Q2 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS Journal of Computing and Information Science in Engineering Pub Date : 2023-10-19 DOI:10.1115/1.4063437
Janet K. Allen, Ehsan T Esfahani, Satyandra K. Gupta, Balan Gurumoorthy, Bin He, Ying Liu, John Michopoulos, Jitesh H. Panchal, Anurag Purwar, Kristina Wärmefjord
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Abstract

Recent advances in computing and information science such as artificial intelligence (AI), machine learning (ML), edge computing, cloud computing, metacomputing, and quantum computing are creating new computing paradigms. These advances are providing new opportunities for new research and application development. For instance, the adoption of Industry 4.0 enabled by AI/ML is fundamentally changing how products are designed, manufactured, maintained, and recycled. It enables consideration of all aspects of the product life cycle and realizing sustainable designs and helps us in achieving carbon neutrality. Intelligent machines such as robots and autonomous vehicles are revolutionizing human–machine interactions and increasing digitalization in the manufacturing and transportation industries. It is important for the Journal of Computing and Information Science in Engineering (JCISE) community to identify challenges and opportunities in these emerging areas and inspire new researchers to join the field and become a part of the community. This Special Issue consists of 19 position papers that span a wide variety of topics of interest to the JCISE community. These position papers identify challenges and opportunities, outline new areas of research, and point out new applications that will be enabled by advances in this field.
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特刊:计算研究的挑战与机遇,以实现下一代工程应用
人工智能(AI)、机器学习(ML)、边缘计算、云计算、元计算和量子计算等计算和信息科学的最新进展正在创造新的计算范式。这些进步为新的研究和应用开发提供了新的机会。例如,由AI/ML实现的工业4.0的采用从根本上改变了产品的设计、制造、维护和回收方式。它可以考虑产品生命周期的各个方面,实现可持续设计,并帮助我们实现碳中和。机器人和自动驾驶汽车等智能机器正在彻底改变人机交互,并提高制造业和运输业的数字化程度。对于工程计算与信息科学杂志(JCISE)社区来说,识别这些新兴领域的挑战和机遇并激励新的研究人员加入该领域并成为社区的一部分是非常重要的。本期特刊由19篇立场论文组成,涵盖了jise社区感兴趣的各种主题。这些立场文件确定了挑战和机遇,概述了新的研究领域,并指出了该领域的进步将使新的应用成为可能。
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来源期刊
CiteScore
6.30
自引率
12.90%
发文量
100
审稿时长
6 months
期刊介绍: The ASME Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to Algorithms, Computational Methods, Computing Infrastructure, Computer-Interpretable Representations, Human-Computer Interfaces, Information Science, and/or System Architectures that aim to improve some aspect of product and system lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, recycling etc.). Applications considered in JCISE manuscripts should be relevant to the mechanical engineering discipline. Papers can be focused on fundamental research leading to new methods, or adaptation of existing methods for new applications. Scope: Advanced Computing Infrastructure; Artificial Intelligence; Big Data and Analytics; Collaborative Design; Computer Aided Design; Computer Aided Engineering; Computer Aided Manufacturing; Computational Foundations for Additive Manufacturing; Computational Foundations for Engineering Optimization; Computational Geometry; Computational Metrology; Computational Synthesis; Conceptual Design; Cybermanufacturing; Cyber Physical Security for Factories; Cyber Physical System Design and Operation; Data-Driven Engineering Applications; Engineering Informatics; Geometric Reasoning; GPU Computing for Design and Manufacturing; Human Computer Interfaces/Interactions; Industrial Internet of Things; Knowledge Engineering; Information Management; Inverse Methods for Engineering Applications; Machine Learning for Engineering Applications; Manufacturing Planning; Manufacturing Automation; Model-based Systems Engineering; Multiphysics Modeling and Simulation; Multiscale Modeling and Simulation; Multidisciplinary Optimization; Physics-Based Simulations; Process Modeling for Engineering Applications; Qualification, Verification and Validation of Computational Models; Symbolic Computing for Engineering Applications; Tolerance Modeling; Topology and Shape Optimization; Virtual and Augmented Reality Environments; Virtual Prototyping
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