Design of UWB MIMO antenna using lean wearable textile substrate for reduced SAR

IF 0.7 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2023-10-12 DOI:10.1108/mi-08-2023-0176

Sasireka Perumalsamy, Kavya G., Rajkumar S.

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Abstract

Purpose This paper aims to propose a two-element dual fed ultra-wideband (UWB) multiple input multiple output (MIMO) antenna system with no additional decoupling structures. The antenna operates from 3.1 to 10.6 GHz. The antenna finds its usage in on-body wearable device applications. Design/methodology/approach The antenna system measures 63.80 × 29.80 × 0.7 mm. The antenna radiating element is designed by using a modified dumbbell-shaped structure. Jean cloth material is used as substrate. The isolation improvement is achieved through spacing between two elements. Findings The proposed antenna has a very low mutual coupling of S 21 < −20 dB and impedance matching of S 11 < −10 dB. The radiation characteristics are stable in the antenna operating region. It provides as ECC < 0.01, diversity gain >9.9 dB. The antenna offers low average specific absorption rate (SAR) of 0.169 W/kg. The simulated and measured results are found to be in reasonable match. Originality/value The MIMO antenna is proposed for on-body communication, hence, a very thin jean cloth material is used as substrate. This negates the necessity of additional material usage in antenna design and the result range indicates good diversity performance and with a low SAR of 0.169 W/kg for on-body performance. This makes it a suitable candidate for textile antenna application.

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基于精益可穿戴纺织品衬底的超宽带MIMO天线设计

本文旨在提出一种无附加去耦结构的双元双馈超宽带多输入多输出(MIMO)天线系统。天线工作在3.1到10.6 GHz之间。这种天线可用于穿戴式设备。天线系统尺寸为63.80 × 29.80 × 0.7 mm。天线辐射单元采用改进的哑铃形结构进行设计。牛仔布材料被用作基材。隔离改进是通过两个元件之间的间距来实现的。所提出的天线具有非常低的s21 <互耦;−20 dB和s11 <的阻抗匹配;−10 dB。天线工作区内的辐射特性是稳定的。它提供了ECC <分集增益>9.9 dB。天线的平均比吸收率(SAR)为0.169 W/kg。仿真结果与实测结果吻合较好。原创性/价值MIMO天线被提议用于身体上通信，因此，使用非常薄的牛仔布材料作为衬底。这消除了在天线设计中使用额外材料的必要性，结果范围表明分集性能良好，机身性能的低SAR为0.169 W/kg。这使其成为纺织天线应用的合适候选者。

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来源期刊

Microelectronics International 工程技术-材料科学：综合

CiteScore

1.90

自引率

9.10%

发文量

审稿时长

>12 weeks

期刊介绍： Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.