Fabrication of superhydrophobic surface by a dimensional change in surface topography of microchannel on polymer substrate through induction-aided hot embossing: parametric investigation and optimization
{"title":"Fabrication of superhydrophobic surface by a dimensional change in surface topography of microchannel on polymer substrate through induction-aided hot embossing: parametric investigation and optimization","authors":"Swarup Deshmukh, Pinal Rana, ARJYAJYOTI GOSWAMI","doi":"10.1088/2051-672x/acee9d","DOIUrl":null,"url":null,"abstract":"Abstract Hot embossing (HE) is a micro-fabrication technique employed to create micron-scale patterns on the polymer substrate. An in-house induction-assisted hot embossing (IHE) setup was fabricated to complete the embossing in a short duration as compared to traditional hot embossing process. This work alters the polymer surface topography to make it superhydrophobic for self-cleaning. Fiber laser machining was used to produce four-microchannel designs on an Aluminum-6061 plate in which the microchannel width was varied from 600 μ m to 150 μ m while maintaining a constant adjacent distance of 300 μ m. This textured plate is employed as a mold in the IHE setup. IHE process parameters, embossing temperature, pressure, time, and deembossing temperature were varied to emboss the mold designs on a polyethylene terephthalate substrate. Thereafter, the embossed microchannel height, surface roughness, and water contact angle perpendicular to the embossed microchannels (WCA ⟂ ) were calculated. The parametric analysis examined how operational factors affected the output. The experiment was done as per the central composite design (experimental design) part of the design-of-experiments useful in the response surface model. Parametric research demonstrates that embossed microchannel height and width had a maximum effect on WCA ⟂ . Type-IV microchannels with 150 μ m width demonstrated the highest WCA ⟂ . The WCA ⟂ was mostly impacted by embossed microchannel height; hence a regression model was created using type-IV channel height data. Analysis of variance showed that embossing temperature mainly impacts microchannel height. The recently invented Jaya-algorithm optimized this model to increase embossed microchannel height and WCA ⟂ . Setting the parameters at the best level predicted by Jaya-algorithm yielded an embossed microchannel height inaccuracy of 2.18%. The WCA ⟂ measured on the surface of a sample prepared at the best parameters was found to be 154.71° <?CDATA $\\pm $?> <mml:math xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" overflow=\"scroll\"> <mml:mo>±</mml:mo> </mml:math> 2°. Lastly, FTIR (Fourier-transform-infrared-spectroscopy) test showed no chemical composition change between the embossed and bare samples.","PeriodicalId":22028,"journal":{"name":"Surface Topography: Metrology and Properties","volume":"19 1","pages":"0"},"PeriodicalIF":2.0000,"publicationDate":"2023-08-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface Topography: Metrology and Properties","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1088/2051-672x/acee9d","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Abstract Hot embossing (HE) is a micro-fabrication technique employed to create micron-scale patterns on the polymer substrate. An in-house induction-assisted hot embossing (IHE) setup was fabricated to complete the embossing in a short duration as compared to traditional hot embossing process. This work alters the polymer surface topography to make it superhydrophobic for self-cleaning. Fiber laser machining was used to produce four-microchannel designs on an Aluminum-6061 plate in which the microchannel width was varied from 600 μ m to 150 μ m while maintaining a constant adjacent distance of 300 μ m. This textured plate is employed as a mold in the IHE setup. IHE process parameters, embossing temperature, pressure, time, and deembossing temperature were varied to emboss the mold designs on a polyethylene terephthalate substrate. Thereafter, the embossed microchannel height, surface roughness, and water contact angle perpendicular to the embossed microchannels (WCA ⟂ ) were calculated. The parametric analysis examined how operational factors affected the output. The experiment was done as per the central composite design (experimental design) part of the design-of-experiments useful in the response surface model. Parametric research demonstrates that embossed microchannel height and width had a maximum effect on WCA ⟂ . Type-IV microchannels with 150 μ m width demonstrated the highest WCA ⟂ . The WCA ⟂ was mostly impacted by embossed microchannel height; hence a regression model was created using type-IV channel height data. Analysis of variance showed that embossing temperature mainly impacts microchannel height. The recently invented Jaya-algorithm optimized this model to increase embossed microchannel height and WCA ⟂ . Setting the parameters at the best level predicted by Jaya-algorithm yielded an embossed microchannel height inaccuracy of 2.18%. The WCA ⟂ measured on the surface of a sample prepared at the best parameters was found to be 154.71° ± 2°. Lastly, FTIR (Fourier-transform-infrared-spectroscopy) test showed no chemical composition change between the embossed and bare samples.
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