Bandwidth and Gain Enhancement of Microstrip Leaky-Wave Antennas with Slot and Defected Ground Structure

IF 0.9 Q3 ENGINEERING, MULTIDISCIPLINARY Journal of Engineering and Technological Sciences Pub Date : 2023-08-31 DOI:10.5614/j.eng.technol.sci.2023.55.3.6
Fitri Yuli Zulkifli, Muhamad Wahyu Iqbal
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Abstract

This paper discusses the design, simulation, and realization of a leaky-wave microstrip antenna with multiple slots and defected ground structure (DGS). The leaky-wave microstrip antenna with multiple slots and DGS was designed to operate at 5.925-6,425 GHz for wireless local area network applications (WLANs), with a gain of ≥4dBi. The antenna uses FR-4 epoxy as the substrate with a dielectric constant of 4.6 and a thickness of 1.6 mm. The leaky-wave microstrip antenna has dimensions of 45.1 mm × 24.8 mm × 1.6 mm, while the leaky-wave microstrip antenna with multiple slots and DGS has dimensions of 40.6 mm × 25 mm × 1.6 mm. The simulation results showed that adding multiple slots and DGS to the leaky-wave microstrip antenna increased the bandwidth from 280 MHz (5.859–6.139 GHz) to 691 MHz (5.854–6.545 GHz) while the gain increased from 4.47 to 5.04 dBi. Meanwhile, the measurement results showed that the bandwidth parameter increased from 273 MHz (5.877–6.150 GHz) to 684 MHz (5.845–6.529 GHz) and the gain parameter from 4.53 to 5.06 dBi at 6 GHz.
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带缝隙和缺陷接地结构的微带漏波天线的带宽和增益增强
本文讨论了一种多沟槽缺陷接地结构漏波微带天线的设计、仿真和实现。漏波微带多槽DGS天线设计工作频率为5.925 ~ 6425 GHz,适用于无线局域网应用,增益≥4dBi。该天线采用FR-4环氧树脂作为衬底,介电常数为4.6,厚度为1.6 mm。漏波微带天线尺寸为45.1 mm × 24.8 mm × 1.6 mm,多槽DGS漏波微带天线尺寸为40.6 mm × 25 mm × 1.6 mm。仿真结果表明,在漏波微带天线上增加多槽和DGS后,天线带宽从280 MHz (5.859 ~ 6.139 GHz)增加到691 MHz (5.854 ~ 6.545 GHz),增益从4.47 dBi增加到5.04 dBi。同时,测量结果表明,在6 GHz时,带宽参数从273 MHz (5.877 ~ 6.150 GHz)增加到684 MHz (5.845 ~ 6.529 GHz),增益参数从4.53 dBi增加到5.06 dBi。
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来源期刊
Journal of Engineering and Technological Sciences
Journal of Engineering and Technological Sciences ENGINEERING, MULTIDISCIPLINARY-
CiteScore
2.30
自引率
11.10%
发文量
77
审稿时长
24 weeks
期刊介绍: Journal of Engineering and Technological Sciences welcomes full research articles in the area of Engineering Sciences from the following subject areas: Aerospace Engineering, Biotechnology, Chemical Engineering, Civil Engineering, Electrical Engineering, Engineering Physics, Environmental Engineering, Industrial Engineering, Information Engineering, Mechanical Engineering, Material Science and Engineering, Manufacturing Processes, Microelectronics, Mining Engineering, Petroleum Engineering, and other application of physical, biological, chemical and mathematical sciences in engineering. Authors are invited to submit articles that have not been published previously and are not under consideration elsewhere.
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