Reviewer's Recognition

IF 1.9 4区 工程技术 Q2 ENGINEERING, MECHANICAL Journal of Heat Transfer-transactions of The Asme Pub Date : 2023-02-08 DOI:10.1115/1.4056754
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引用次数: 0

Abstract

The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.R. AbdelmaksoudH. Abdelmotalib AhmedL. AbreuS. AcharyaS. AderaB. AinaV. AjaevM. AlqeflL. AlvesB. AnM. AndoA. AvramenkoC. BalajiR. BallariniD. BanerjeeH. BaoA. BarikA. BarlettaN. BasuS. BayraktarM. BenedettiJ. BennerD. BhanjaA. BhattacharyaS. BhavnaniV. BiancoG. BiswasM. BlythD. Borca-TasciucD. CalamasC. CamciA. CandadaiZ. CaoD. CarringtonL. CattaniM. CelliD. ChatterjeeV. ChauhanT. ChenX. ChenY.-B. ChenY. ChenP. CoelhoR. CottaS. CuiP. CumberV. D'AlessandroX. DaiS. DashK. DaunG. DayyabuR. DevireddyV. DhirY. DiaoC. DinhB. DogruozL. DombrovskyC. A. DoraoX. DuF. DuanX. DuanP. DuttaS. EkkadA. El MansouriS. ElbelF. ErchiquiM. Erfanian NakhchiB. EvansO. EzekoyeL. FanP. FaroukM. FatehA. FedorovT. FengT. FisherE. Fornalik-WajsD. FranceR. FrederickM. FriestadB. FronkR. GangulyD. GargS. GarimellaM. GartiaS. GhiaasiaanP. GhoshS. Ghosh MoulicP. S. GhoshdastidarH. GilbertB.J. GireeshaL. GlicksmanV. GoelA. GogineniL. GongJ. GoreG. GraeberC. GreenA. GuptaA. GuptaV. GuptaJ. HanM. HaqueH. HeM. HodesY. HuH. HuangA. HusseinB. IversonR. IwataV. IyerA. JacobiG. JacobsA. JainA. JainJ. JalilY. JaluriaL. JinH. JinA. JoardarC. JogM. JogM. JonesG. JonesY. JoshiA. KabeelH. KahalerrasH. KahveciS. KandlikarH. KangG. KaramanisA. KassabS. KedukodiM. KedzierskiU. KemerliR. KempersK. KeniarC. KharangateH. KimT. KimL. KleinW. KlinbunA. KoonsrisukK. KotaR. KovacsU. KoyluD. KrasnovA. KrishnaS. KrishnanF. Sunil KumarP. KumarR. KumarS. KumarS. KumarS. KwarkJ. LageL. LamA. LavineR. LewisD. LiX. LiT. LiX. LiY. LiZ. LiY. LianY. LiaoJ. LienhardA. LimiaA. LinJ. LiuL. LiuZ. LiuJ. LukesS. LynchG. LyraM. MB. MaG. MadireddyJ. MahanD. MaillerO. MancaT. MancusoS. ManoharanM. MarengoL. MaroccoS. MarooN. MassarottiO. MatteiS. MazumderR. McMastersZ. MehrezM. MengucN. MiljkovicM. MisaleA. MishraP. MishraD. MoD. ModestA. MohamadM. MollaP. MondalR. MoradiG. MorenoA. MorrisA. MukherjeeK. MuralidharA. MurataY. MuzychkaV. NairA. NarainA. NarasimhanS. NarayananR. NarayananS. NardiniS. NarumanchiA. NayakK. NgA. NiroZ. NiuH. OrlandeN. OzalpC. PachecoL. PagliariniJ. PalkoC. PanZ. PanK. PanchalJ. PanditC. PantR. PaoliE. PapanicolaouA. PatilS. PatilY. PelesA. PerumalP. PhelanJ. PhilipA. PickelD. PillaiL. PilonI. PopR. PrasherD. PriyankaM. QasimH. QiZ. QinA. QuintinoR. RajS. RajendranC. RajuJ. RamboB. Ramos AlvaradoM. RaoW. RaoA. RashadD. ReesM. Risso ErreraN. RobertsB. RuanK. RykaczewskiA. SadaghianiS. SadhalS. SahaR. SalaryI. SarrisA. SasmitoV. SathyamurthiE. SewallC. SewatkarM. ShafahiP. ShambergerJ. ShanY. ShenM. SheremetI. ShevchukD. ShinS. ShinG. ShitR. ShuklaP. SiddheshwarS. SiddiqaM. SiegelA. Silva NetoA. SinghP. SinghS. SinghM. SmithS. SobhaniA. SommersL. SphaierK. SrinivasanV. SrinivasanH. StruchtrupH. StrumpfY. SuB. SundenM. SzucsR. TanG. TangC. TeoA. ThakurA. TiaraY. TijaniA. TolpadiS. TomlinsonZ. TongC. TorresM. TradatD. TripathiM. TurkyilmazogluI. UllahE. VS. VankaP. Vayssiere BrandaoA. ViswanathanB. WahlsZ. WanG. WangX. WangX. WangZ. WangB. WebbX. WeiS. WenY. WonK. WoodburyN. WrightG. XieQ. XiongH. XuF. XuX. XuK. XuX. XuN. YaghoobianY. YamaguchiX. YanA. YukselD. ZhangG. ZhangY. ZhangZ. ZhaoX. ZhaoY. ZhongC. ZhouL. ZhuG. Ziskind
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来源期刊
自引率
0.00%
发文量
182
审稿时长
4.7 months
期刊介绍: Topical areas including, but not limited to: Biological heat and mass transfer; Combustion and reactive flows; Conduction; Electronic and photonic cooling; Evaporation, boiling, and condensation; Experimental techniques; Forced convection; Heat exchanger fundamentals; Heat transfer enhancement; Combined heat and mass transfer; Heat transfer in manufacturing; Jets, wakes, and impingement cooling; Melting and solidification; Microscale and nanoscale heat and mass transfer; Natural and mixed convection; Porous media; Radiative heat transfer; Thermal systems; Two-phase flow and heat transfer. Such topical areas may be seen in: Aerospace; The environment; Gas turbines; Biotechnology; Electronic and photonic processes and equipment; Energy systems, Fire and combustion, heat pipes, manufacturing and materials processing, low temperature and arctic region heat transfer; Refrigeration and air conditioning; Homeland security systems; Multi-phase processes; Microscale and nanoscale devices and processes.
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