Nanoindentation response of small-volume piezoelectric structures and multi-layered composites: modeling the effect of surrounding materials

Guang Cheng, Zonglin Wu, T. A. Venkatesh
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Abstract

With piezoelectric small-volume composites gaining importance in smart device applications and nanoindentation being recognized as a versatile method for assessing the properties of layer materials, the present study is focused on the indentation response of the small-volume piezoelectric structures multi-layered composites. In particular, the effects of the nature of the substrate and surrounding materials, on the indentation response of piezoelectric nanocomposites, such as nanoislands, nanowires, and multi-layered composites are investigated. By developing three-dimensional finite element modeling, the complex interaction between the fundamental elastic, piezoelectric and dielectric properties of the piezoelectric materials and the elastic, plastic and electrically conducting or insulating properties of the surrounding materials, on the indentation response of the layered composites is analyzed. It is found that: (i) a substrate material that is elastically stiffer enhances the mechanical indentation stiffness and the electric indentation stiffness while plastic deformation in the substrate causes a reduction in the mechanical and electrical indentation stiffness; (ii) the effective piezoelectric and mechanical indentation stiffnesses of piezoelectric multi-layered composites are bounded by the corresponding characteristics of the bulk material counterparts from which the individual layers are constructed; (iii) electrically conducting surrounding materials produce a softening effect while insulating materials enhance the electrical indentation stiffness resulting in more charges being accumulated during the indentation process.
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小体积压电结构和多层复合材料的纳米压痕响应:模拟周围材料的影响
随着压电小体积复合材料在智能器件中的应用越来越重要,纳米压痕被认为是评估层状材料性能的一种通用方法,本文的研究重点是小体积压电结构多层复合材料的压痕响应。特别地,研究了基板和周围材料的性质对压电纳米复合材料(如纳米岛、纳米线和多层复合材料)压痕响应的影响。通过建立三维有限元模型,分析了压电材料的基本弹性、压电和介电性能与周围材料的弹性、塑性和导电或绝缘性能之间的复杂相互作用对层状复合材料压痕响应的影响。研究发现:(1)基材弹性刚度越大,机械压痕刚度和电压痕刚度越大,而基材塑性变形导致机械压痕刚度和电压痕刚度降低;(ii)压电多层复合材料的有效压电和机械压痕刚度受到构成各层的大块材料的相应特性的限制;(iii)导电的周围材料产生软化效应,而绝缘材料增强电压痕刚度,导致压痕过程中积聚更多电荷。
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