Effective Fault Localization Approach for High Speed Transceiver Failure: From Non-destructive to Destructive

Kuan Lai Khei, Liew Chiun Ning, Goh Lay Lay, Wu Jia Jun, Sailesh Suthar
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Abstract

Abstract It has been a challenge to perform failure analysis for miniaturization of process node technology in high-speed transceiver. Failure analysis plays an important role in root cause analysis to enable R&D, product quality & reliabily improvement. This paper demonstrated an effective FA approach on a real case with ADPLL functional failure within a high-Speed transceiver in complex sub-nano FPGA. This successful case is achieved by incorporating Analog Probe (APROBE), Infrared Emission Microscopy (IREM), extensive layout study, delayering, Nanoprobing and Scanning Electron Microscopy (SEM) for defect localization.
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高速收发器故障的有效故障定位方法:从无损到破坏性
摘要高速收发器工艺节点技术的小型化对失效分析提出了挑战。失效分析在根本原因分析中起着重要的作用,使研发、产品质量和产品质量得以提高。reliabily改进。针对复杂亚纳米FPGA中高速收发器ADPLL功能失效的实际情况,给出了一种有效的FA方法。这个成功的案例是通过结合模拟探针(APROBE)、红外发射显微镜(IREM)、广泛的布局研究、分层、纳米探测和扫描电子显微镜(SEM)进行缺陷定位实现的。
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