Cover Image, Volume 1, Number 2, November 2023

Electron Pub Date : 2023-11-28 DOI:10.1002/elt2.23
Li Sun, Yating Li, Jiacheng Xie, Liqi Zhou, Peng Wang, Jian-Bin Xu, Yi Shi, Xinran Wang, Daowei He
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Abstract

The cover image is the structure diagram of bottom-gate staggered OTFT with the circuit diagram as the background, where the channel material is a typical small-molecule C10-DNTT. The metal atoms can penetrate into the charge transport layer, with damage-free, via modulating organic crystal thickness during thermal evaporation of electrode. This could effectively reduce the contact resistance to aid the development of high-performance organic devices and circuits.

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封面图片,第一卷,第2期,2023年11月
封面图像为以电路图为背景的底栅交错OTFT的结构图,其中通道材料为典型的小分子C10-DNTT。在电极热蒸发过程中,通过调节有机晶体厚度,金属原子可以无损伤地渗透到电荷输运层中。这可以有效地降低接触电阻,以帮助高性能有机器件和电路的发展。
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Issue Information Cover Image, Volume 2, Number 3, August 2024 Cover Image, Volume 2, Number 3, August 2024 Cover Image, Volume 2, Number 3, August 2024 Self-sensing piezoresistive aerospace composites based on CNTs and 2D material coated fabric sensors
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