Integration of a void healing criterion in multi-scale modeling of hot rolling

IF 3.9 Q2 ENGINEERING, INDUSTRIAL Advances in Industrial and Manufacturing Engineering Pub Date : 2023-11-28 DOI:10.1016/j.aime.2023.100134
Dorothea Czempas , Conrad Liebsch , Gerhard Hirt
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Abstract

After closure, voids need to be healed through bonding and interface dissolution to restore the mechanical properties and produce a sound product. For the prediction of void healing and the respective process optimization, a void healing criterion, spanning all three phases is needed. While hot rolling is generally suited for void healing, with large deformations at hydrostatic pressure as well as high temperatures, not all regions in the workpiece offer the same void healing conditions. Due to gradients of these metrics e. g. along the normal direction, a space-resolved approach is needed. Previously, a practical void healing criterion combining void closure and subsequent recrystallization has been proposed and applied to exemplary hot rolling processes. Besides a broader application of the criterion, adding the process parameters roll diameter and temperature, the present paper mainly aims for the experimental validation of this criterion. In bonding trials, a positive influence of temperature and strain on the bond strength has been found. While no clear correlation of the holding time on the bond strength was detectible without concurrent contact pressure the experiments suggested a saturation strain as an indicator for void healing instead. Accordingly, the criterion has been revised and a strain-based criterion proposed, applied, and compared to the previously introduced recrystallization-based void healing criterion.

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热轧多尺度建模中空洞愈合准则的集成
闭合后,需要通过粘接和界面溶解来修复空隙,以恢复机械性能,生产出良好的产品。为了预测孔洞愈合和优化相应的过程,需要一个跨越这三个阶段的孔洞愈合准则。虽然热轧通常适合于在静水压和高温下进行大变形的空洞修复,但并非工件中的所有区域都提供相同的空洞修复条件。由于这些指标的梯度,例如沿法线方向,需要一个空间分辨的方法。以前,一个实用的空洞愈合标准结合空洞关闭和随后的再结晶已被提出并应用于示范性热轧工艺。本论文的主要目的是对该准则进行实验验证,并将该准则的应用范围扩大,增加了工艺参数轧辊直径和温度。在粘接试验中,发现温度和应变对粘接强度有正影响。虽然在没有同时接触压力的情况下,保持时间与粘结强度之间没有明显的相关性,但实验表明,饱和应变可以作为空洞愈合的指标。因此,对该标准进行了修订,并提出了基于应变的标准,应用了该标准,并与先前引入的基于再结晶的空隙愈合标准进行了比较。
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来源期刊
Advances in Industrial and Manufacturing Engineering
Advances in Industrial and Manufacturing Engineering Engineering-Engineering (miscellaneous)
CiteScore
6.60
自引率
0.00%
发文量
31
审稿时长
18 days
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