Surface composition driven rippling of oblique Ar+ irradiated SiC/Si(111) thin films

IF 7.5 Q1 CHEMISTRY, PHYSICAL Applied Surface Science Advances Pub Date : 2023-12-08 DOI:10.1016/j.apsadv.2023.100549
Divya Gupta , Rimpi Kumari , Rahul Singhal , Pratap K. Sahoo , Sanjeev Aggarwal
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Abstract

Oblique ion beam patterned and structured thin films hold promise as an advanced material for applications to photonics, micro- to nano-electronics, electro-optical and electrochemical devices fabrication. Herein, for the first time, we report the fabrication of patterned and structured SiC thin films over Si(111) by obliquely incident Ar+ beam. We show that at a short time scale, carbon clusters possessing nano-dimensional size evolve while ripple structures with direction parallel to the ion beam projection emerge at later time scales. The roughness evolution plot follows exponential and power law scaling at low and high bombarding time (in terms of ion fluence). The underlying mechanism is the altered surface layer composition due to the non-stoichiometric sputtering of silicon and carbon. The optical bands corresponding to silicon carbide (3.27–4.23 eV) & silicon (1.15–1.45 eV) co-exist for lower argon ion fluences while optical bands of silicon (1.15- 1.45 eV) remains and silicon carbide vanishes for higher argon ion fluences. Our experimental findings demonstrated the fabrication of ripple patterns over radiation tolerant, thermally and physically stable SiC by large area irradiation and capability to tailor the temporal characteristics of these evolved structures.

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斜 Ar+辐照碳化硅/硅(111)薄膜的表面成分驱动波纹效应
斜离子束图案化和结构化薄膜有望成为一种先进的材料,应用于光子学、微纳电子学、电子光学和电化学器件的制造。在此,我们首次报道了利用斜入射 Ar+ 射束在 Si(111) 上制备出图案化和结构化碳化硅薄膜。我们的研究表明,在较短的时间尺度内,具有纳米尺寸的碳簇不断演化,而在较长的时间尺度内,出现了与离子束投射方向平行的波纹结构。粗糙度演化图在低轰击时间和高轰击时间(以离子通量计)下呈指数和幂律缩放。其基本机理是硅和碳的非化学计量溅射导致了表层成分的改变。在较低的氩离子通量下,碳化硅(3.27-4.23 eV)和amp; 硅(1.15-1.45 eV)的光带并存,而在较高的氩离子通量下,硅(1.15-1.45 eV)的光带仍然存在,碳化硅消失。我们的实验结果表明,通过大面积辐照,可以在耐辐射、热稳定和物理稳定的碳化硅上制造出波纹图案,并且能够定制这些演化结构的时间特性。
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来源期刊
CiteScore
8.10
自引率
1.60%
发文量
128
审稿时长
66 days
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