Subcooled Pool Boiling on Hierarchical Micro- and Nanostructure-Modified Copper Surfaces in HFE-7100 Dielectric Liquid

IF 2.7 3区 工程技术 Q2 ENGINEERING, MECHANICAL Nanoscale and Microscale Thermophysical Engineering Pub Date : 2023-12-17 DOI:10.1080/15567265.2023.2293710
Shayan Davani, Bin Zhang, Brendon Doran, Luke Hansen, Mohammad Khan, Mahdi Roodbari, W. J. Meng, Arden L. Moore
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HFE-7100 介质液体中分层微结构和纳米结构修饰的铜表面上的过冷池沸腾
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来源期刊
Nanoscale and Microscale Thermophysical Engineering
Nanoscale and Microscale Thermophysical Engineering 工程技术-材料科学:表征与测试
CiteScore
5.90
自引率
2.40%
发文量
12
审稿时长
3.3 months
期刊介绍: Nanoscale and Microscale Thermophysical Engineering is a journal covering the basic science and engineering of nanoscale and microscale energy and mass transport, conversion, and storage processes. In addition, the journal addresses the uses of these principles for device and system applications in the fields of energy, environment, information, medicine, and transportation. The journal publishes both original research articles and reviews of historical accounts, latest progresses, and future directions in this rapidly advancing field. Papers deal with such topics as: transport and interactions of electrons, phonons, photons, and spins in solids, interfacial energy transport and phase change processes, microscale and nanoscale fluid and mass transport and chemical reaction, molecular-level energy transport, storage, conversion, reaction, and phase transition, near field thermal radiation and plasmonic effects, ultrafast and high spatial resolution measurements, multi length and time scale modeling and computations, processing of nanostructured materials, including composites, micro and nanoscale manufacturing, energy conversion and storage devices and systems, thermal management devices and systems, microfluidic and nanofluidic devices and systems, molecular analysis devices and systems.
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