Zijia Liu , Xunguo Gong , Jinran Cheng , Lei Shao , Chunshui Wang , Jian Jiang , Ruiqing Cheng , Jun He
{"title":"Wafer-scale synthesis of two-dimensional materials for integrated electronics","authors":"Zijia Liu , Xunguo Gong , Jinran Cheng , Lei Shao , Chunshui Wang , Jian Jiang , Ruiqing Cheng , Jun He","doi":"10.1016/j.chip.2023.100080","DOIUrl":null,"url":null,"abstract":"<div><p><strong>Two-dimensional (2D) van der Waals materials</strong> <strong>have attracted great</strong> <strong>interest</strong> <strong>and facilitated</strong> <strong>the development of</strong> <strong>post-Moore</strong> <strong>electronics</strong> <strong>owing</strong> <strong>to their novel physical properties and high compatibility with traditional microfabrication techniques. Their</strong> <strong>wafer-scale</strong> <strong>synthesis has become a critical challenge for</strong> <strong>large-scale</strong> <strong>integrated applications. Although the</strong> <strong>wafer-scale</strong> <strong>synthesis approaches for some 2D materials have been extensively explored, the preparation of</strong> <strong>high-quality</strong> <strong>thin films with</strong> <strong>well-controlled</strong> <strong>thickness remains a big challenge. This review focuses on the</strong> <strong>wafer-scale</strong> <strong>synthesis of 2D materials and their applications in integrated electronics. First</strong>ly<strong>,</strong> <strong>several representative 2D layered materials including their crystal structures and unique electronic properties</strong> <strong>were introduced</strong><strong>. Then, the current synthesis strategies of 2D layered materials at the wafer scale, which are divided into “top-down” and “bottom-up”,</strong> <strong>were</strong> <strong>reviewed in depth. After</strong><strong>wards</strong><strong>, the applications of 2D materials wafer in integrated electrical and optoelectronic devices</strong> <strong>were</strong> <strong>discussed. Finally, the current challenges and future prospects for 2D integrated electronics</strong> <strong>were</strong> <strong>presented.</strong> <strong>It is</strong> <strong>hope</strong><strong>d</strong> <strong>that this review will provide comprehensive and insightful guidance for the development of</strong> <strong>wafer-scale</strong> <strong>2D materials and their integrated applications.</strong></p></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"3 1","pages":"Article 100080"},"PeriodicalIF":0.0000,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2709472323000436/pdfft?md5=46d0186f7a7f1ea18f1a294fdc0b0c25&pid=1-s2.0-S2709472323000436-main.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Chip","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2709472323000436","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Two-dimensional (2D) van der Waals materialshave attracted greatinterestand facilitatedthe development ofpost-Mooreelectronicsowingto their novel physical properties and high compatibility with traditional microfabrication techniques. Theirwafer-scalesynthesis has become a critical challenge forlarge-scaleintegrated applications. Although thewafer-scalesynthesis approaches for some 2D materials have been extensively explored, the preparation ofhigh-qualitythin films withwell-controlledthickness remains a big challenge. This review focuses on thewafer-scalesynthesis of 2D materials and their applications in integrated electronics. Firstly,several representative 2D layered materials including their crystal structures and unique electronic propertieswere introduced. Then, the current synthesis strategies of 2D layered materials at the wafer scale, which are divided into “top-down” and “bottom-up”,werereviewed in depth. Afterwards, the applications of 2D materials wafer in integrated electrical and optoelectronic deviceswerediscussed. Finally, the current challenges and future prospects for 2D integrated electronicswerepresented.It ishopedthat this review will provide comprehensive and insightful guidance for the development ofwafer-scale2D materials and their integrated applications.