Probabilistic modeling of hardware and software interactions for system reliability assessment

IF 1.3 4区 工程技术 Q4 ENGINEERING, INDUSTRIAL Quality Engineering Pub Date : 2023-12-29 DOI:10.1080/08982112.2023.2274563
Alex Davila-Frias, Nita Yodo, Om P. Yadav, Phattara Khumprom
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为系统可靠性评估建立硬件和软件相互作用的概率模型
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来源期刊
Quality Engineering
Quality Engineering ENGINEERING, INDUSTRIAL-STATISTICS & PROBABILITY
CiteScore
3.90
自引率
10.00%
发文量
52
审稿时长
>12 weeks
期刊介绍: Quality Engineering aims to promote a rich exchange among the quality engineering community by publishing papers that describe new engineering methods ready for immediate industrial application or examples of techniques uniquely employed. You are invited to submit manuscripts and application experiences that explore: Experimental engineering design and analysis Measurement system analysis in engineering Engineering process modelling Product and process optimization in engineering Quality control and process monitoring in engineering Engineering regression Reliability in engineering Response surface methodology in engineering Robust engineering parameter design Six Sigma method enhancement in engineering Statistical engineering Engineering test and evaluation techniques.
期刊最新文献
Probabilistic modeling of hardware and software interactions for system reliability assessment Utilizing jackknife and bootstrap to understand tensile stress to failure of an epoxy resin Mixed-type defect pattern recognition in noisy labeled wafer bin maps Simultaneous classification and out-of-distribution detection for wafer bin maps Reliability evaluation of a novel metal oxide-aluminum glycerol film capacitor using nonlinear degradation modeling with dependency considerations
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