A two-stage solution method for the design problem of medium-thick plates in steel plants

IF 2.5 Q2 ENGINEERING, INDUSTRIAL IET Collaborative Intelligent Manufacturing Pub Date : 2024-01-13 DOI:10.1049/cim2.12091
Gongzhuang Peng, Boyu Zhang, Shenglong Jiang
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Abstract

The medium-thick plate is an important type of steel product widely used in construction and engineering machinery. The orders are usually characterised by multiple specifications and small quantities. The plate design is an important part in the production process of medium-thick plate, which includes the combination of sub-plates and the size design of the motherboard. A multi-objective model for medium-thick plate design is proposed based on the 2D bin packing model, comprehensively considering spatial and size constraints of the plate production. A two-stage genetic algorithm (TSGA) is developed to solve the proposed model. In the first stage, an improved GA is used to optimise the corresponding relationship between the sub-plates and the slab, as well as the size of the motherboard. In the second stage, an exact algorithm based on the integer programming model is applied to calculate the order layout to minimise the surplus materials. To validate the proposed method, computational experiments are conducted based on actual production data from a steel plant. The experimental results show the effectiveness of the TSGA algorithm in solving the plate design problem.

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钢铁厂中厚板设计问题的两阶段求解法
中厚板是一种重要的钢材,广泛应用于建筑和工程机械领域。其订单通常具有规格多、数量小的特点。中厚板设计是中厚板生产过程中的重要环节,包括子板的组合和母板的尺寸设计。基于二维料仓包装模型,综合考虑板材生产的空间和尺寸约束,提出了中厚板设计的多目标模型。开发了一种两阶段遗传算法(TSGA)来求解所提出的模型。在第一阶段,使用改进的遗传算法优化子板和板坯之间的对应关系以及主板的尺寸。在第二阶段,应用基于整数编程模型的精确算法来计算顺序布局,以尽量减少剩余材料。为了验证所提出的方法,我们根据一家钢铁厂的实际生产数据进行了计算实验。实验结果表明,TSGA 算法在解决板材设计问题方面非常有效。
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来源期刊
IET Collaborative Intelligent Manufacturing
IET Collaborative Intelligent Manufacturing Engineering-Industrial and Manufacturing Engineering
CiteScore
9.10
自引率
2.40%
发文量
25
审稿时长
20 weeks
期刊介绍: IET Collaborative Intelligent Manufacturing is a Gold Open Access journal that focuses on the development of efficient and adaptive production and distribution systems. It aims to meet the ever-changing market demands by publishing original research on methodologies and techniques for the application of intelligence, data science, and emerging information and communication technologies in various aspects of manufacturing, such as design, modeling, simulation, planning, and optimization of products, processes, production, and assembly. The journal is indexed in COMPENDEX (Elsevier), Directory of Open Access Journals (DOAJ), Emerging Sources Citation Index (Clarivate Analytics), INSPEC (IET), SCOPUS (Elsevier) and Web of Science (Clarivate Analytics).
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