Adaptation and comparative analysis of HSPICE level-61 and level-62 model for a-IGZO thin film transistors

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC International Journal of Numerical Modelling-Electronic Networks Devices and Fields Pub Date : 2024-01-15 DOI:10.1002/jnm.3210
Divya Dubey, Manish Goswami, Kavindra Kandpal
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Abstract

This paper presents a Computer-aided design (CAD) model for a-IGZO thin film transistors (TFTs) by adapting SPICE level-61 RPI a-Si: H (Hydrogenated Amorphous Silicon) TFT model and level-62 RPI Poly-Si (Poly Silicon) TFT model. This work provides a complete understanding of SPICE level-61 and 62 model parameters, which must be tuned for a-IGZO TFT simulation. The adapted SPICE models of level-61 and level-62 could model all regions of operation of the TFT, that is, above-threshold and below-threshold regions. Adapted RPI poly-Si model also shows the kink effect in ZnO thin film transistors (TFTs) due to the recombination of electron–hole pairs in the channel via boundary trap states present in the poly-Si TFTs thereby increasing the drain current in the transistors above pinch-off region. The extracted performance parameters of the adapted models were found to be contiguous with experimental results. The maximum deviation in the subthreshold slope is approximately 5 mV/decade for level-61 a-Si TFT, and for level-62 poly-Si TFT, deviation in the subthreshold slope is even less, that is, 0.2 mV/decade. The experimental and simulated characteristics, extracted on-to-off ratio, negative bias reverse saturation current, and threshold voltage were almost similar. However, an average deviation of 2.4% and 2.27% was observed in the output characteristics of the adapted level-61 and level-62 models, respectively.

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针对 a-IGZO 薄膜晶体管的 HSPICE 61 级和 62 级模型的调整和比较分析
本文通过调整 SPICE 第 61 级 RPI a-Si:H(氢化非晶硅)TFT 模型和第 62 级 RPI Poly-Si(多晶硅)TFT 模型,提出了 a-IGZO 薄膜晶体管(TFT)的计算机辅助设计(CAD)模型。这项工作提供了对 SPICE 第 61 级和第 62 级模型参数的完整理解,这些参数必须在 a-IGZO TFT 仿真中进行调整。调整后的 SPICE 61 级和 62 级模型可模拟 TFT 的所有工作区域,即阈值以上和阈值以下区域。调整后的 RPI 多晶硅模型还显示了氧化锌薄膜晶体管(TFT)中的扭结效应,这是由于电子-空穴对通过多晶硅 TFT 中存在的边界陷阱态在沟道中重组,从而增加了晶体管中掐断区以上的漏极电流。经调整的模型提取的性能参数与实验结果一致。对于 61 级 a-Si TFT,次阈值斜率的最大偏差约为 5 mV/decade,而对于 62 级多晶硅 TFT,次阈值斜率的偏差更小,仅为 0.2 mV/decade。实验和模拟特性、提取的导通与关断比、负偏压反向饱和电流和阈值电压几乎相似。不过,经调整的 61 级和 62 级模型的输出特性平均偏差分别为 2.4% 和 2.27%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
4.60
自引率
6.20%
发文量
101
审稿时长
>12 weeks
期刊介绍: Prediction through modelling forms the basis of engineering design. The computational power at the fingertips of the professional engineer is increasing enormously and techniques for computer simulation are changing rapidly. Engineers need models which relate to their design area and which are adaptable to new design concepts. They also need efficient and friendly ways of presenting, viewing and transmitting the data associated with their models. The International Journal of Numerical Modelling: Electronic Networks, Devices and Fields provides a communication vehicle for numerical modelling methods and data preparation methods associated with electrical and electronic circuits and fields. It concentrates on numerical modelling rather than abstract numerical mathematics. Contributions on numerical modelling will cover the entire subject of electrical and electronic engineering. They will range from electrical distribution networks to integrated circuits on VLSI design, and from static electric and magnetic fields through microwaves to optical design. They will also include the use of electrical networks as a modelling medium.
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