{"title":"Adaptation and comparative analysis of HSPICE level-61 and level-62 model for a-IGZO thin film transistors","authors":"Divya Dubey, Manish Goswami, Kavindra Kandpal","doi":"10.1002/jnm.3210","DOIUrl":null,"url":null,"abstract":"<p>This paper presents a Computer-aided design (CAD) model for a-IGZO thin film transistors (TFTs) by adapting SPICE level-61 RPI a-Si: H (Hydrogenated Amorphous Silicon) TFT model and level-62 RPI Poly-Si (Poly Silicon) TFT model. This work provides a complete understanding of SPICE level-61 and 62 model parameters, which must be tuned for a-IGZO TFT simulation. The adapted SPICE models of level-61 and level-62 could model all regions of operation of the TFT, that is, above-threshold and below-threshold regions. Adapted RPI poly-Si model also shows the kink effect in ZnO thin film transistors (TFTs) due to the recombination of electron–hole pairs in the channel via boundary trap states present in the poly-Si TFTs thereby increasing the drain current in the transistors above pinch-off region. The extracted performance parameters of the adapted models were found to be contiguous with experimental results. The maximum deviation in the subthreshold slope is approximately 5 mV/decade for level-61 a-Si TFT, and for level-62 poly-Si TFT, deviation in the subthreshold slope is even less, that is, 0.2 mV/decade. The experimental and simulated characteristics, extracted on-to-off ratio, negative bias reverse saturation current, and threshold voltage were almost similar. However, an average deviation of 2.4% and 2.27% was observed in the output characteristics of the adapted level-61 and level-62 models, respectively.</p>","PeriodicalId":50300,"journal":{"name":"International Journal of Numerical Modelling-Electronic Networks Devices and Fields","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-01-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Numerical Modelling-Electronic Networks Devices and Fields","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/jnm.3210","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents a Computer-aided design (CAD) model for a-IGZO thin film transistors (TFTs) by adapting SPICE level-61 RPI a-Si: H (Hydrogenated Amorphous Silicon) TFT model and level-62 RPI Poly-Si (Poly Silicon) TFT model. This work provides a complete understanding of SPICE level-61 and 62 model parameters, which must be tuned for a-IGZO TFT simulation. The adapted SPICE models of level-61 and level-62 could model all regions of operation of the TFT, that is, above-threshold and below-threshold regions. Adapted RPI poly-Si model also shows the kink effect in ZnO thin film transistors (TFTs) due to the recombination of electron–hole pairs in the channel via boundary trap states present in the poly-Si TFTs thereby increasing the drain current in the transistors above pinch-off region. The extracted performance parameters of the adapted models were found to be contiguous with experimental results. The maximum deviation in the subthreshold slope is approximately 5 mV/decade for level-61 a-Si TFT, and for level-62 poly-Si TFT, deviation in the subthreshold slope is even less, that is, 0.2 mV/decade. The experimental and simulated characteristics, extracted on-to-off ratio, negative bias reverse saturation current, and threshold voltage were almost similar. However, an average deviation of 2.4% and 2.27% was observed in the output characteristics of the adapted level-61 and level-62 models, respectively.
期刊介绍:
Prediction through modelling forms the basis of engineering design. The computational power at the fingertips of the professional engineer is increasing enormously and techniques for computer simulation are changing rapidly. Engineers need models which relate to their design area and which are adaptable to new design concepts. They also need efficient and friendly ways of presenting, viewing and transmitting the data associated with their models.
The International Journal of Numerical Modelling: Electronic Networks, Devices and Fields provides a communication vehicle for numerical modelling methods and data preparation methods associated with electrical and electronic circuits and fields. It concentrates on numerical modelling rather than abstract numerical mathematics.
Contributions on numerical modelling will cover the entire subject of electrical and electronic engineering. They will range from electrical distribution networks to integrated circuits on VLSI design, and from static electric and magnetic fields through microwaves to optical design. They will also include the use of electrical networks as a modelling medium.