Preparation and Characterization of Thermally Conductive High Impact Polystyrene/AlN Composite

IF 3.4 4区 化学 Q2 POLYMER SCIENCE International Journal of Polymer Science Pub Date : 2024-01-19 DOI:10.1155/2024/2723981
Nghiem Thi Thuong, Nguyen Ba Lam, Pham Anh Son, Nguyen Ba Chien, Nguyen Pham Duy Linh, Chu Thi Hai Nam, Nguyen Anh Vu
{"title":"Preparation and Characterization of Thermally Conductive High Impact Polystyrene/AlN Composite","authors":"Nghiem Thi Thuong, Nguyen Ba Lam, Pham Anh Son, Nguyen Ba Chien, Nguyen Pham Duy Linh, Chu Thi Hai Nam, Nguyen Anh Vu","doi":"10.1155/2024/2723981","DOIUrl":null,"url":null,"abstract":"In the present work, AlN was modified with vinyltriethoxysilane (VTES), and its effect on the properties of a thermally conductive composite of high impact polystyrene (HIPS), and AlN was investigated. Three composites, HIPS/AlN5, HIPS/AlN9, and HIPS/moAlN9, were prepared by mixing HIPS and AlN in a toluene solution, followed by hot pressing. The HIPS/AlN composite was characterized by tensile test, impact strength, flexural strength, and hardness shore D. The sample HIPS/moAlN9 showed the improvement of these properties compared to that of the HIPS/AlN9 sample. The increment of those mechanical properties was due to the good interaction between the modified AlN and HIPS resin matrix, which was revealed by morphology observation by SEM. Incorporating modified AlN into the HIPS matrix was also found to enhance the thermal conductivity by about 20%, from 0.15 for HIPS to 0.18 (W/m·K) for HIPS/moAlN9. It was explained due to the good adherence of AlN to the HIPS, which provided more thermal conductive routes than HIPS/AlN. This approach provides a possible strategy to prepare thermally conductive HIPS composite, which may be suitable for electronic device that required heat dissipation.","PeriodicalId":14283,"journal":{"name":"International Journal of Polymer Science","volume":null,"pages":null},"PeriodicalIF":3.4000,"publicationDate":"2024-01-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Polymer Science","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1155/2024/2723981","RegionNum":4,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0

Abstract

In the present work, AlN was modified with vinyltriethoxysilane (VTES), and its effect on the properties of a thermally conductive composite of high impact polystyrene (HIPS), and AlN was investigated. Three composites, HIPS/AlN5, HIPS/AlN9, and HIPS/moAlN9, were prepared by mixing HIPS and AlN in a toluene solution, followed by hot pressing. The HIPS/AlN composite was characterized by tensile test, impact strength, flexural strength, and hardness shore D. The sample HIPS/moAlN9 showed the improvement of these properties compared to that of the HIPS/AlN9 sample. The increment of those mechanical properties was due to the good interaction between the modified AlN and HIPS resin matrix, which was revealed by morphology observation by SEM. Incorporating modified AlN into the HIPS matrix was also found to enhance the thermal conductivity by about 20%, from 0.15 for HIPS to 0.18 (W/m·K) for HIPS/moAlN9. It was explained due to the good adherence of AlN to the HIPS, which provided more thermal conductive routes than HIPS/AlN. This approach provides a possible strategy to prepare thermally conductive HIPS composite, which may be suitable for electronic device that required heat dissipation.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
导热高抗冲聚苯乙烯/氮化铝复合材料的制备与表征
在本研究中,用乙烯基三乙氧基硅烷(VTES)对 AlN 进行了改性,并研究了其对高抗冲聚苯乙烯(HIPS)和 AlN 的导热复合材料性能的影响。通过在甲苯溶液中混合 HIPS 和 AlN,然后进行热压,制备了三种复合材料:HIPS/AlN5、HIPS/AlN9 和 HIPS/moAlN9。与 HIPS/AlN9 样品相比,HIPS/moAlN9 样品的这些性能都有所提高。这些机械性能的提高得益于改性 AlN 与 HIPS 树脂基体之间良好的相互作用,这一点可通过扫描电镜的形态观察得到。在 HIPS 基体中加入改性 AlN 还能将热导率提高约 20%,从 HIPS 的 0.15 提高到 HIPS/moAlN9 的 0.18(W/m-K)。这是因为 AlN 与 HIPS 有良好的粘附性,从而提供了比 HIPS/AlN 更多的导热途径。这种方法为制备导热 HIPS 复合材料提供了一种可行的策略,可能适用于需要散热的电子设备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
CiteScore
6.10
自引率
0.00%
发文量
55
审稿时长
>12 weeks
期刊介绍: The International Journal of Polymer Science is a peer-reviewed, Open Access journal that publishes original research articles as well as review articles on the chemistry and physics of macromolecules.
期刊最新文献
Characterisation of Luffa cylindrica Fibre from Cameroon for Use in Composites: Effect of Alkaline Treatment An Experimental Study of the Properties of Carbon Fiber/Epoxy Composites Mixed with Rubber Granules Experimental Investigation on the 3D Printing of Nylon Reinforced by Carbon Fiber through Fused Filament Fabrication Process, Effects of Extruder Temperature, and Printing Speed Fracture Resistance of Endodontically Treated Teeth Restored Using Multifiber Posts Compared with Single Fiber Posts Comparison of the Film Properties of Lemon and Sour Cherry Seed Essential Oil-Added Glycerol and/or Sorbitol-Plasticized Corn, Potato, Rice, Tapioca, and Wheat Starch-Based Edible Films
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1