ISLPED 2023: International Symposium on Low-Power Electronics and Design

IF 1.9 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Design & Test Pub Date : 2024-01-17 DOI:10.1109/mdat.2023.3324518
Axel Jantsch, Swaroop Ghosh, Umit Ogras, Pascal Meinerzhagen
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Abstract

The ISLPED 2023 conference was held as a presence-only event from 6 to 8 August 2023, at the premises of the Technische Universität TU Wien near the center of Vienna, Austria. It was the first presence-only meeting after the disruption due to the COVID-19 pandemic, which was very much enjoyed by all delegates. 35 full papers and 18 posters were presented in two parallel sessions. Also, two keynote presentations, one special session, and one panel were organized. In addition, a design contest with seven participants was conducted. Again, artificial neural network-based machine-learning topics have been prominently represented in both the technical and special sessions.
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ISLPED 2023:低功耗电子与设计国际研讨会
ISLPED 2023会议于2023年8月6日至8日在奥地利维也纳市中心附近的维也纳科技大学(Technische Universität TU Wien)举行。这是因 COVID-19 大流行而中断后的首次现场会议,所有代表都非常享受这次会议。两场平行会议共发表了 35 篇论文全文和 18 张海报。会议还组织了两次主旨报告、一次特别会议和一次小组讨论。此外,还举办了一次设计竞赛,共有 7 人参加。同样,基于人工神经网络的机器学习主题在技术会议和特别会议上都有突出表现。
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来源期刊
IEEE Design & Test
IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
3.80
自引率
5.00%
发文量
98
期刊介绍: IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.
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