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Silicon Lifecycle Management (SLM): Requirements, Trends, and Opportunities 硅生命周期管理（SLM）：需求、趋势和机遇
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Design & Test
Pub Date : 2024-09-02 DOI: 10.1109/mdat.2024.3453192
Mehdi Tahoori, Seyedeh Maryam Ghasemi, Yervant Zorian
{"title":"Silicon Lifecycle Management (SLM): Requirements, Trends, and Opportunities","authors":"Mehdi Tahoori, Seyedeh Maryam Ghasemi, Yervant Zorian","doi":"10.1109/mdat.2024.3453192","DOIUrl":"https://doi.org/10.1109/mdat.2024.3453192","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"2 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142183625","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Exploring Resilience of LPDRAM against RowHammer 探索 LPDRAM 抵御 RowHammer 的能力
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Design & Test
Pub Date : 2024-09-02 DOI: 10.1109/mdat.2024.3453197
Anandpreet Kaur, Pravin Srivastav, Bibhas Ghoshal
{"title":"Exploring Resilience of LPDRAM against RowHammer","authors":"Anandpreet Kaur, Pravin Srivastav, Bibhas Ghoshal","doi":"10.1109/mdat.2024.3453197","DOIUrl":"https://doi.org/10.1109/mdat.2024.3453197","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"131 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142183628","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Postquantum Cryptography for Internet of Things 物联网后量子密码学
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Design & Test
Pub Date : 2024-08-28 DOI: 10.1109/mdat.2024.3419062
Partha Pratim Pande
{"title":"Postquantum Cryptography for Internet of Things","authors":"Partha Pratim Pande","doi":"10.1109/mdat.2024.3419062","DOIUrl":"https://doi.org/10.1109/mdat.2024.3419062","url":null,"abstract":"<fig orientation=\"portrait\" position=\"float\" xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <graphic orientation=\"portrait\" position=\"float\" xlink:href=\"pande-3419062.tif\"/> </fig>","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"440 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142223903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Design & Test Publication Information IEEE 设计与测试出版物信息
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Design & Test
Pub Date : 2024-08-28 DOI: 10.1109/mdat.2024.3436433
{"title":"IEEE Design & Test Publication Information","authors":"","doi":"10.1109/mdat.2024.3436433","DOIUrl":"https://doi.org/10.1109/mdat.2024.3436433","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"23 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142183627","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Get in the Conversation! 参与对话！
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Design & Test
Pub Date : 2024-08-28 DOI: 10.1109/mdat.2024.3447860
{"title":"Get in the Conversation!","authors":"","doi":"10.1109/mdat.2024.3447860","DOIUrl":"https://doi.org/10.1109/mdat.2024.3447860","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"307 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142223902","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
DATE 2024: Consolidating the New Conference Format DATE 2024：整合新的会议形式
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Design & Test
Pub Date : 2024-08-28 DOI: 10.1109/mdat.2024.3394320
Andy D. Pimentel, Valeria Bertacco, Aida Todri-Sanial, Theocharis Theocharides
{"title":"DATE 2024: Consolidating the New Conference Format","authors":"Andy D. Pimentel, Valeria Bertacco, Aida Todri-Sanial, Theocharis Theocharides","doi":"10.1109/mdat.2024.3394320","DOIUrl":"https://doi.org/10.1109/mdat.2024.3394320","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"390 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142183629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TechRxiv: Share Your Preprint Research With the World! TechRxiv：与世界分享您的预印本研究成果！
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Design & Test
Pub Date : 2024-08-28 DOI: 10.1109/mdat.2024.3436437
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/mdat.2024.3436437","DOIUrl":"https://doi.org/10.1109/mdat.2024.3436437","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"161 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142183630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Membership IEEE 会员
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Design & Test
Pub Date : 2024-08-28 DOI: 10.1109/mdat.2024.3436431
{"title":"IEEE Membership","authors":"","doi":"10.1109/mdat.2024.3436431","DOIUrl":"https://doi.org/10.1109/mdat.2024.3436431","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"32 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142183632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Issue on Postquantum Cryptography for Internet of Things 物联网后量子密码学特刊
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Design & Test
Pub Date : 2024-08-28 DOI: 10.1109/mdat.2024.3400894
Shivam Bhasin, Anupam Chattopadhyay, Tim Güneysu, Swarup Bhunia
{"title":"Special Issue on Postquantum Cryptography for Internet of Things","authors":"Shivam Bhasin, Anupam Chattopadhyay, Tim Güneysu, Swarup Bhunia","doi":"10.1109/mdat.2024.3400894","DOIUrl":"https://doi.org/10.1109/mdat.2024.3400894","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"32 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142183633","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Interview With Vishwani Agrawal 采访 Vishwani Agrawal
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Design & Test
Pub Date : 2024-08-28 DOI: 10.1109/mdat.2024.3416393
Nicola Nicolici
Presents a panel discussion on the topic of Vishwani Agrawal.
介绍以 Vishwani Agrawal 为主题的小组讨论。
{"title":"Interview With Vishwani Agrawal","authors":"Nicola Nicolici","doi":"10.1109/mdat.2024.3416393","DOIUrl":"https://doi.org/10.1109/mdat.2024.3416393","url":null,"abstract":"Presents a panel discussion on the topic of Vishwani Agrawal.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"20 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142183626","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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