Multi Degrees-of-Freedom Hybrid Piezoelectric-Electrostatic MEMS Actuators Integrated With Displacement Sensors

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Microelectromechanical Systems Pub Date : 2023-12-19 DOI:10.1109/JMEMS.2023.3341039
Almur A. S. Rabih;Seyedfakhreddin Nabavi;Michaël Ménard;Frederic Nabki
{"title":"Multi Degrees-of-Freedom Hybrid Piezoelectric-Electrostatic MEMS Actuators Integrated With Displacement Sensors","authors":"Almur A. S. Rabih;Seyedfakhreddin Nabavi;Michaël Ménard;Frederic Nabki","doi":"10.1109/JMEMS.2023.3341039","DOIUrl":null,"url":null,"abstract":"This work presents novel multi degrees-of-freedom (DOF) actuators based on piezoelectric and electrostatic actuation to generate both in-plane and out-of-plane motions, intended to position a suspended optical waveguide for chip-to-chip alignment in photonic integrated circuits. In this context, the mechanical structures of the actuators with a suspended platform to carry the waveguide, are designed to house aluminum nitride (AlN) as the piezoelectric material for generating out-of-plane motion and a comb-drive, whose fixed and moveable fingers are positioned on the same layer for in-plane motion. Two distinct designs, i.e., a 2-DOF design with motions along the Z-and Y-axes and a 3-DOF design with motions along the Z-, Y-, and X-axes were fabricated and tested. Both designs include capacitive-based displacement sensors to track the motions in Z-and Y-axes. Experimental results at ±60 V indicate that 3 devices of each design give an average displacement of 3.16 ± \n<inline-formula> <tex-math>$0.34~\\mu \\text{m}$ </tex-math></inline-formula>\n and 0.63 ± \n<inline-formula> <tex-math>$0.04~\\mu \\text{m}$ </tex-math></inline-formula>\n in the Z-axis for the 2-DOF and 3-DOF designs, respectively. For the Y-axis at 120 V, the average results for the two designs respectively were found to be 3.06 ± \n<inline-formula> <tex-math>$0.17~\\mu \\text{m}$ </tex-math></inline-formula>\n and 7.38 ± \n<inline-formula> <tex-math>$0.29~\\mu \\text{m}$ </tex-math></inline-formula>\n, with the ability to extended the later to \n<inline-formula> <tex-math>$10.69~\\mu \\text{m}$ </tex-math></inline-formula>\n at 140 V. In the X-axis, the 3-DOF design can produce total of 300 nm of displacement at ±100 V. The capacitance measurements were found to correlate well with the tracked displacement. Furthermore, simultaneous activation of more than one actuator could mitigate misalignment and align the platform with a fixed surface. [2023-0148]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 1","pages":"21-36"},"PeriodicalIF":2.5000,"publicationDate":"2023-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectromechanical Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10365658/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

This work presents novel multi degrees-of-freedom (DOF) actuators based on piezoelectric and electrostatic actuation to generate both in-plane and out-of-plane motions, intended to position a suspended optical waveguide for chip-to-chip alignment in photonic integrated circuits. In this context, the mechanical structures of the actuators with a suspended platform to carry the waveguide, are designed to house aluminum nitride (AlN) as the piezoelectric material for generating out-of-plane motion and a comb-drive, whose fixed and moveable fingers are positioned on the same layer for in-plane motion. Two distinct designs, i.e., a 2-DOF design with motions along the Z-and Y-axes and a 3-DOF design with motions along the Z-, Y-, and X-axes were fabricated and tested. Both designs include capacitive-based displacement sensors to track the motions in Z-and Y-axes. Experimental results at ±60 V indicate that 3 devices of each design give an average displacement of 3.16 ± $0.34~\mu \text{m}$ and 0.63 ± $0.04~\mu \text{m}$ in the Z-axis for the 2-DOF and 3-DOF designs, respectively. For the Y-axis at 120 V, the average results for the two designs respectively were found to be 3.06 ± $0.17~\mu \text{m}$ and 7.38 ± $0.29~\mu \text{m}$ , with the ability to extended the later to $10.69~\mu \text{m}$ at 140 V. In the X-axis, the 3-DOF design can produce total of 300 nm of displacement at ±100 V. The capacitance measurements were found to correlate well with the tracked displacement. Furthermore, simultaneous activation of more than one actuator could mitigate misalignment and align the platform with a fixed surface. [2023-0148]
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与位移传感器集成的多自由度压电-静电混合 MEMS 执行器
本研究提出了基于压电和静电驱动的新型多自由度(DOF)致动器,用于产生平面内和平面外运动,目的是定位悬浮光波导,以便在光子集成电路中进行芯片到芯片对齐。在这种情况下,推杆的机械结构带有一个承载波导的悬浮平台,其设计包括氮化铝(AlN)作为压电材料,用于产生平面外运动,以及一个梳状驱动器,其固定和可动指位于同一层,用于平面内运动。我们制作并测试了两种不同的设计,即沿 Z 轴和 Y 轴运动的 2-DOF 设计和沿 Z 轴、Y 轴和 X 轴运动的 3-DOF 设计。这两种设计都包括基于电容的位移传感器,用于跟踪 Z 轴和 Y 轴的运动。±60V电压下的实验结果表明,对于2-DOF和3-DOF设计,每种设计的3个器件在Z轴上的平均位移分别为3.16 ± $0.34~mu \text{m}$和0.63 ± $0.04~mu \text{m}$。在 120 V 电压下的 Y 轴上,两种设计的平均结果分别为 3.06 ± $0.17~mu \text{m}$ 和 7.38 ± $0.29~mu \text{m}$ ,后一种设计的平均结果可以扩展到 10.06 ± $0.17~mu \text{m}$ 和 7.38 ± $0.29~mu \text{m}$ 。在 X 轴上,3-DOF 设计可以在 ±100 V 的电压下产生总计 300 nm 的位移。此外,同时激活一个以上的致动器可减轻错位,并使平台与固定表面对齐。[2023-0148]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
期刊最新文献
Front Cover Table of Contents Journal of Microelectromechanical Systems Publication Information TechRxiv: Share Your Preprint Research with the World! Capacitive Micromachined Transducers With Out-of-Plane Repulsive Actuation for Enhancing Ultrasound Transmission in Air
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