Almur A. S. Rabih;Seyedfakhreddin Nabavi;Michaël Ménard;Frederic Nabki
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引用次数: 0
Abstract
This work presents novel multi degrees-of-freedom (DOF) actuators based on piezoelectric and electrostatic actuation to generate both in-plane and out-of-plane motions, intended to position a suspended optical waveguide for chip-to-chip alignment in photonic integrated circuits. In this context, the mechanical structures of the actuators with a suspended platform to carry the waveguide, are designed to house aluminum nitride (AlN) as the piezoelectric material for generating out-of-plane motion and a comb-drive, whose fixed and moveable fingers are positioned on the same layer for in-plane motion. Two distinct designs, i.e., a 2-DOF design with motions along the Z-and Y-axes and a 3-DOF design with motions along the Z-, Y-, and X-axes were fabricated and tested. Both designs include capacitive-based displacement sensors to track the motions in Z-and Y-axes. Experimental results at ±60 V indicate that 3 devices of each design give an average displacement of 3.16 ±
$0.34~\mu \text{m}$
and 0.63 ±
$0.04~\mu \text{m}$
in the Z-axis for the 2-DOF and 3-DOF designs, respectively. For the Y-axis at 120 V, the average results for the two designs respectively were found to be 3.06 ±
$0.17~\mu \text{m}$
and 7.38 ±
$0.29~\mu \text{m}$
, with the ability to extended the later to
$10.69~\mu \text{m}$
at 140 V. In the X-axis, the 3-DOF design can produce total of 300 nm of displacement at ±100 V. The capacitance measurements were found to correlate well with the tracked displacement. Furthermore, simultaneous activation of more than one actuator could mitigate misalignment and align the platform with a fixed surface. [2023-0148]
期刊介绍:
The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.