{"title":"Soft ferrite 3D printing of magnetic couplers of inductive power transfer systems","authors":"Meilin Hu, Udaya Kumara Madawala, Olaf Diegel","doi":"10.1049/pel2.12668","DOIUrl":null,"url":null,"abstract":"<p>Traditional soft ferrite manufacturing is limited to simple geometries and materials, while 3D printing offers greater flexibility for complex designs. Notably, soft ferrites are crucial for magnetic couplers (pads) in inductive power transfer (IPT) systems to achieve efficient wireless power transmission. The adoption of soft ferrite 3D printing in IPT systems could lead to significantly improved magnetic coupler design, yet research in this area is limited. Hence, the paper first makes a comprehensive comparison of the existing soft ferrite 3D printing methods to ascertain their suitability for magnetic couplers in IPT systems, and then proposes the binder jetting (BJT) as a potential 3D printing approach that could be appropriate for IPT magnetic coupler implementation being versatile, cost-effective, and suitable for large-scale manufacturing with high precision. This paper explores the suitability of BJT by 3D printing toroid cores with Mn–Zn ferrite powder under different sintering temperature profiles. Experimental results are presented to show that toroid cores can be 3D printed with high printing precision, mechanical strength, and a relative permeability of 10. This paper also highlights the impact of sintering temperature on 3D-printed cores, the challenges, limitations, and future research directions of soft ferrite 3D printing for IPT magnetic couplers by the BJT method.</p>","PeriodicalId":56302,"journal":{"name":"IET Power Electronics","volume":"17 15","pages":"2179-2191"},"PeriodicalIF":1.9000,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1049/pel2.12668","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Power Electronics","FirstCategoryId":"5","ListUrlMain":"https://ietresearch.onlinelibrary.wiley.com/doi/10.1049/pel2.12668","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Traditional soft ferrite manufacturing is limited to simple geometries and materials, while 3D printing offers greater flexibility for complex designs. Notably, soft ferrites are crucial for magnetic couplers (pads) in inductive power transfer (IPT) systems to achieve efficient wireless power transmission. The adoption of soft ferrite 3D printing in IPT systems could lead to significantly improved magnetic coupler design, yet research in this area is limited. Hence, the paper first makes a comprehensive comparison of the existing soft ferrite 3D printing methods to ascertain their suitability for magnetic couplers in IPT systems, and then proposes the binder jetting (BJT) as a potential 3D printing approach that could be appropriate for IPT magnetic coupler implementation being versatile, cost-effective, and suitable for large-scale manufacturing with high precision. This paper explores the suitability of BJT by 3D printing toroid cores with Mn–Zn ferrite powder under different sintering temperature profiles. Experimental results are presented to show that toroid cores can be 3D printed with high printing precision, mechanical strength, and a relative permeability of 10. This paper also highlights the impact of sintering temperature on 3D-printed cores, the challenges, limitations, and future research directions of soft ferrite 3D printing for IPT magnetic couplers by the BJT method.
期刊介绍:
IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes:
Applications:
Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances.
Technologies:
Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies.
Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials.
Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems.
Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques.
Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material.
Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest.
Special Issues. Current Call for papers:
Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf