Jakub Preis, Donghua Xu, Brian K. Paul, Peter A. Eschbach, S. Pasebani
{"title":"Effect of Liquid Miscibility Gap on Defects in Inconel 625–GRCop42 Joints through Analysis of Gradient Composition Microstructure","authors":"Jakub Preis, Donghua Xu, Brian K. Paul, Peter A. Eschbach, S. Pasebani","doi":"10.3390/jmmp8010042","DOIUrl":null,"url":null,"abstract":"Joining of Cu-based dispersion-strengthened alloys to Ni-based superalloys has garnered increased attention for liquid rocket engine applications due to the high thermal conductivity of Cu-based alloys and high temperature tensile strength of Ni-based superalloys. However, such joints can suffer from cracking when joined via liquid state processes, leading to part failure. In this work, compositions of 15–95 wt.% GRCop42 are alloyed with Inconel 625 and characterized to better understand the root cause of cracking. Results indicate a lack of miscibility between Cu-deprived and Cu-rich liquids in compositions corresponding to 30–95 wt.% GRCop42. Two distinct morphologies are observed and explained by use of CALPHAD; Cu-deprived dendrites with Cu-rich interdendritic zones at 30–50 wt.% GRCop42 and Cu-deprived spheres surrounded by a Cu-rich matrix at 60–95 wt.% GRCop42. Phase analysis reveals brittle intermetallic phases precipitate in the 60–95 wt.% GRCop42 Cu-deprived region. Three cracking mechanisms are proposed herein that provide guidance on the avoidance of defects Ni-based superalloy to Cu-based dispersion strengthened alloy joints.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"83 12","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-02-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3390/jmmp8010042","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Joining of Cu-based dispersion-strengthened alloys to Ni-based superalloys has garnered increased attention for liquid rocket engine applications due to the high thermal conductivity of Cu-based alloys and high temperature tensile strength of Ni-based superalloys. However, such joints can suffer from cracking when joined via liquid state processes, leading to part failure. In this work, compositions of 15–95 wt.% GRCop42 are alloyed with Inconel 625 and characterized to better understand the root cause of cracking. Results indicate a lack of miscibility between Cu-deprived and Cu-rich liquids in compositions corresponding to 30–95 wt.% GRCop42. Two distinct morphologies are observed and explained by use of CALPHAD; Cu-deprived dendrites with Cu-rich interdendritic zones at 30–50 wt.% GRCop42 and Cu-deprived spheres surrounded by a Cu-rich matrix at 60–95 wt.% GRCop42. Phase analysis reveals brittle intermetallic phases precipitate in the 60–95 wt.% GRCop42 Cu-deprived region. Three cracking mechanisms are proposed herein that provide guidance on the avoidance of defects Ni-based superalloy to Cu-based dispersion strengthened alloy joints.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
Indexed/Abstracted:
Web of Science SCIE
Scopus
CAS
INSPEC
Portico