Effect of Liquid Miscibility Gap on Defects in Inconel 625–GRCop42 Joints through Analysis of Gradient Composition Microstructure

IF 4.7 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-02-14 DOI:10.3390/jmmp8010042
Jakub Preis, Donghua Xu, Brian K. Paul, Peter A. Eschbach, S. Pasebani
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Abstract

Joining of Cu-based dispersion-strengthened alloys to Ni-based superalloys has garnered increased attention for liquid rocket engine applications due to the high thermal conductivity of Cu-based alloys and high temperature tensile strength of Ni-based superalloys. However, such joints can suffer from cracking when joined via liquid state processes, leading to part failure. In this work, compositions of 15–95 wt.% GRCop42 are alloyed with Inconel 625 and characterized to better understand the root cause of cracking. Results indicate a lack of miscibility between Cu-deprived and Cu-rich liquids in compositions corresponding to 30–95 wt.% GRCop42. Two distinct morphologies are observed and explained by use of CALPHAD; Cu-deprived dendrites with Cu-rich interdendritic zones at 30–50 wt.% GRCop42 and Cu-deprived spheres surrounded by a Cu-rich matrix at 60–95 wt.% GRCop42. Phase analysis reveals brittle intermetallic phases precipitate in the 60–95 wt.% GRCop42 Cu-deprived region. Three cracking mechanisms are proposed herein that provide guidance on the avoidance of defects Ni-based superalloy to Cu-based dispersion strengthened alloy joints.
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通过梯度成分显微结构分析液体混溶间隙对铬镍铁合金 625-GRCop42 接头缺陷的影响
由于铜基合金的高导热性和镍基超合金的高温抗拉强度,铜基分散强化合金与镍基超合金的连接在液体火箭发动机应用中越来越受到关注。然而,此类接头在通过液态工艺连接时可能会出现开裂,导致部件失效。在这项研究中,我们将 15-95 重量%的 GRCop42 与铬镍铁合金 625 进行了合金化,并对其进行了表征,以更好地了解开裂的根本原因。结果表明,在 30-95 重量%的 GRCop42 成分中,缺铜液体和富铜液体之间缺乏互溶性。通过使用 CALPHAD 可以观察到并解释两种不同的形态:30-50 wt.% GRCop42 时,缺铜树枝状物与富含铜的树枝状物间区域;60-95 wt.% GRCop42 时,缺铜球体被富含铜的基体包围。相分析表明,在 60-95 重量%的 GRCop42 缺铜区域析出了脆性金属间相。本文提出了三种开裂机制,为避免镍基超级合金与铜基弥散强化合金接头出现缺陷提供了指导。
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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