Yavuz Akdevelioğlu, M. Begum Alanalp, Ferit Siyahcan, J. Randall, Michael Gehrung, Ali Durmus, M. Nofar
{"title":"Joncryl chain extender reactivity with polylactide: Effect of d-lactide content, Joncryl type, and processing temperature","authors":"Yavuz Akdevelioğlu, M. Begum Alanalp, Ferit Siyahcan, J. Randall, Michael Gehrung, Ali Durmus, M. Nofar","doi":"10.1122/8.0000718","DOIUrl":null,"url":null,"abstract":"In this study, a highly crystallizable and an amorphous polylactide (i.e., cPLA and aPLA) with, respectively, low (0.5 mol. %) and high (12 mol. %) d-lactic acid contents and similar molecular weights were melt compounded with two different multifunctional epoxy-based Joncryl chain extenders (CEs, i.e., ADR 4400 and 4468) at 190 °C. Reactivity of Joncryl grades with aPLA was also explored at melt processing temperatures of 150, 170, and 210 °C. Small amplitude oscillatory shear rheological analysis was conducted to understand the extent of the Joncryl reaction with PLA molecules, and the results were confirmed with molecular weight determination using gel permeation chromatography. Extensional viscosity of the processed samples was also compared to control their strain hardening behavior. Results showed that the Joncryl reaction with cPLA and aPLA differs in terms of preference for chain extension or branching, indicating that molecular regularity affected the interactions with both Joncryl grades during reactive melt processing. Moreover, although the increase in processing temperature accelerated PLA degradation, it noticeably increased the reactivity of both Joncryl grades with aPLA. In all cases, ADR 4468 was more reactive in molecular chain extension/branching due to its higher functionality than ADR 4400. Differential scanning calorimetry results also revealed that the crystallization of cPLA was differently affected by the change in the Joncryl content and type.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"46 4","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1122/8.0000718","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this study, a highly crystallizable and an amorphous polylactide (i.e., cPLA and aPLA) with, respectively, low (0.5 mol. %) and high (12 mol. %) d-lactic acid contents and similar molecular weights were melt compounded with two different multifunctional epoxy-based Joncryl chain extenders (CEs, i.e., ADR 4400 and 4468) at 190 °C. Reactivity of Joncryl grades with aPLA was also explored at melt processing temperatures of 150, 170, and 210 °C. Small amplitude oscillatory shear rheological analysis was conducted to understand the extent of the Joncryl reaction with PLA molecules, and the results were confirmed with molecular weight determination using gel permeation chromatography. Extensional viscosity of the processed samples was also compared to control their strain hardening behavior. Results showed that the Joncryl reaction with cPLA and aPLA differs in terms of preference for chain extension or branching, indicating that molecular regularity affected the interactions with both Joncryl grades during reactive melt processing. Moreover, although the increase in processing temperature accelerated PLA degradation, it noticeably increased the reactivity of both Joncryl grades with aPLA. In all cases, ADR 4468 was more reactive in molecular chain extension/branching due to its higher functionality than ADR 4400. Differential scanning calorimetry results also revealed that the crystallization of cPLA was differently affected by the change in the Joncryl content and type.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
Indexed/Abstracted:
Web of Science SCIE
Scopus
CAS
INSPEC
Portico