Deep Container Fabrication by Forging with High- and Low-Density Wood

IF 4.7 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-02-06 DOI:10.3390/jmmp8010030
Hinako Uejima, Takashi Kuboki, Soichi Tanaka, S. Kajikawa
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Abstract

This paper presents a method for applying forging to high-density wood. A cylindrical container was formed using a closed die, and the appropriate conditions for temperature and punch length were evaluated. Ulin, which is a high-density wood, and Japanese cedar, which is a low-density wood and widely used in Japan, were used as test materials. The pressing directions were longitudinal and radial based on wood fiber orientation, and the shape and density of the resulting containers were evaluated. In the case of ulin, cracks decreased by increasing the temperature, while temperature had little effect on Japanese cedar. Containers without cracks were successfully formed by using a punch of appropriate length. The density of the containers was uniform in the punch length l = 20 and 40 mm in the L-directional pressing and l = 20 mm in the R-directional pressing when using ulin, with an average density of 1.34 g/cm3. This result indicates the forging ability of ulin is high compared to that of commonly used low-density woods. In summary, this paper investigated the appropriate parameters for forging with ulin. As a result, products of more uniform density than products made by cutting were obtained.
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利用高密度和低密度木材锻造深集装箱
本文介绍了一种对高密度木材进行锻造的方法。使用封闭模具形成了一个圆柱形容器,并对温度和冲头长度的适当条件进行了评估。试验材料为高密度木材乌林和日本广泛使用的低密度木材日本杉。根据木材纤维的取向,压制方向分为纵向和径向,并对压制出的容器的形状和密度进行了评估。就乌林而言,温度升高裂缝减少,而温度对日本杉木的影响很小。使用适当长度的冲头可以成功地形成没有裂缝的容器。使用 ulin 时,容器的密度在冲头长度 l = 20 和 40 毫米(L 向压制)以及 l = 20 毫米(R 向压制)范围内均匀一致,平均密度为 1.34 克/立方厘米。这一结果表明,与常用的低密度木材相比,ulin 的锻造能力较高。总之,本文研究了使用 ulin 进行锻造的适当参数。其结果是,获得了比切割产品密度更均匀的产品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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