Hinako Uejima, Takashi Kuboki, Soichi Tanaka, S. Kajikawa
{"title":"Deep Container Fabrication by Forging with High- and Low-Density Wood","authors":"Hinako Uejima, Takashi Kuboki, Soichi Tanaka, S. Kajikawa","doi":"10.3390/jmmp8010030","DOIUrl":null,"url":null,"abstract":"This paper presents a method for applying forging to high-density wood. A cylindrical container was formed using a closed die, and the appropriate conditions for temperature and punch length were evaluated. Ulin, which is a high-density wood, and Japanese cedar, which is a low-density wood and widely used in Japan, were used as test materials. The pressing directions were longitudinal and radial based on wood fiber orientation, and the shape and density of the resulting containers were evaluated. In the case of ulin, cracks decreased by increasing the temperature, while temperature had little effect on Japanese cedar. Containers without cracks were successfully formed by using a punch of appropriate length. The density of the containers was uniform in the punch length l = 20 and 40 mm in the L-directional pressing and l = 20 mm in the R-directional pressing when using ulin, with an average density of 1.34 g/cm3. This result indicates the forging ability of ulin is high compared to that of commonly used low-density woods. In summary, this paper investigated the appropriate parameters for forging with ulin. As a result, products of more uniform density than products made by cutting were obtained.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"53 3","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3390/jmmp8010030","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents a method for applying forging to high-density wood. A cylindrical container was formed using a closed die, and the appropriate conditions for temperature and punch length were evaluated. Ulin, which is a high-density wood, and Japanese cedar, which is a low-density wood and widely used in Japan, were used as test materials. The pressing directions were longitudinal and radial based on wood fiber orientation, and the shape and density of the resulting containers were evaluated. In the case of ulin, cracks decreased by increasing the temperature, while temperature had little effect on Japanese cedar. Containers without cracks were successfully formed by using a punch of appropriate length. The density of the containers was uniform in the punch length l = 20 and 40 mm in the L-directional pressing and l = 20 mm in the R-directional pressing when using ulin, with an average density of 1.34 g/cm3. This result indicates the forging ability of ulin is high compared to that of commonly used low-density woods. In summary, this paper investigated the appropriate parameters for forging with ulin. As a result, products of more uniform density than products made by cutting were obtained.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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