{"title":"Analysis of the Lifecycles of Automotive Resistor Lead in Random Vibration","authors":"Huang Linsen","doi":"10.1007/s10836-024-06099-6","DOIUrl":null,"url":null,"abstract":"<p>The lifecycles of vehicular resistor lead in random vibration environment were analyzed in this technical note and the finite element model of a vehicular printed circuit board (PCB) was established. It is with two short edges of PCB fixed for boundary condition to simulate the actual working conditions of the vehicle driving on the road, the constrained modal analysis was simulated and experimental verification were carried out. Both the PCB and the vehicular resistor which soldered on PCB were excited vertically according to Standard GJB150. Based on simulated vibration excitation environment, the power spectral density (PSD) stress value of the resistor lead was calculated. The lifecycles of the resistor lead were calculated theoretically and were verified by following failure-oriented accelerated testing (FOAT). Finally, in order to extend the lifecycles of resistor lead, an improved solution for PCB is put forward.</p>","PeriodicalId":501485,"journal":{"name":"Journal of Electronic Testing","volume":"81 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Testing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/s10836-024-06099-6","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The lifecycles of vehicular resistor lead in random vibration environment were analyzed in this technical note and the finite element model of a vehicular printed circuit board (PCB) was established. It is with two short edges of PCB fixed for boundary condition to simulate the actual working conditions of the vehicle driving on the road, the constrained modal analysis was simulated and experimental verification were carried out. Both the PCB and the vehicular resistor which soldered on PCB were excited vertically according to Standard GJB150. Based on simulated vibration excitation environment, the power spectral density (PSD) stress value of the resistor lead was calculated. The lifecycles of the resistor lead were calculated theoretically and were verified by following failure-oriented accelerated testing (FOAT). Finally, in order to extend the lifecycles of resistor lead, an improved solution for PCB is put forward.
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