High-Quality Light Field Microscope Imaging Based on Microlens Arrays

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Microelectromechanical Systems Pub Date : 2024-01-11 DOI:10.1109/JMEMS.2023.3349299
Tongkai Gu;Sitong Yan;Lanlan Wang;Yasheng Chang;Hongzhong Liu
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Abstract

High-quality optical observation through traditional microscopes faces significant challenges due to their low spatial sampling and the limited ability to respond only to the light intensity characteristics of optoelectronic devices. This limitation results in an inability to measure other critical optical information during imaging, such as phase, angle, polarization, and coherence. In response to these challenges, light field microscope (LFM) as a powerful imaging technique is capable of measuring samples with unprecedented depth and detail. LFM overcomes the limitations of conventional microscope methods by capturing both spatial and angular information of light rays. To further demonstrate these capabilities, the LFM based on microlens arrays is constructed here. These arrays are fabricated using advanced techniques such as laser lithography, microimprinting, and self-assembly technology. Using light field imaging, image segmentation methods, and deep learning fusion, the imaging quality is nearly doubled, significantly enhancing the quality of observations. LFM based on microlens arrays offers great promise for improving the quality of imaging observations in the field of microsope. [2023-0167]
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基于微透镜阵列的高质量光场显微成像技术
由于传统显微镜的空间采样率低,而且只能对光电设备的光强特性做出有限的反应,因此通过传统显微镜进行高质量的光学观测面临着巨大的挑战。这种限制导致无法测量成像过程中的其他关键光学信息,如相位、角度、偏振和相干性。为了应对这些挑战,光场显微镜(LFM)作为一种强大的成像技术,能够以前所未有的深度和细节测量样品。光场显微镜通过捕捉光线的空间和角度信息,克服了传统显微镜方法的局限性。为了进一步展示这些能力,本文构建了基于微透镜阵列的 LFM。这些阵列是利用激光光刻、微压印和自组装技术等先进技术制造的。通过光场成像、图像分割方法和深度学习融合,成像质量提高了近一倍,显著提升了观测质量。基于微透镜阵列的 LFM 为提高显微镜领域的成像观测质量带来了巨大希望。[2023-0167]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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