{"title":"Correlation of Radiation-Induced Interface Traps With Band Edge Energy Through Band Structure-Based Analysis of Electrostatics of UTB SOI Devices","authors":"Nalin Vilochan Mishra;Aditya Sankar Medury","doi":"10.1109/TDMR.2024.3366592","DOIUrl":null,"url":null,"abstract":"The effect of Radiation on the semiconductor-oxide interface, inducing interface trap states, has generally only been experimentally measured, which makes it difficult to quantify the impact of this radiation on device electrostatics. For an Ultra-Thin-Body (UTB) MOS device, the 1-D Band structure along the direction of confinement, if solved self-consistently with the 1-D Poisson’s equation, while varying the band edge energy \n<inline-formula> <tex-math>$(\\Delta E_{edge})$ </tex-math></inline-formula>\n at the \n<inline-formula> <tex-math>$Si-SiO_{2}$ </tex-math></inline-formula>\n interface, can enable the quantification of the effect of interface trap states on channel electrostatics, while also accounting for Quantum Confinement Effects. In this work, we present an approach to correlate the radiation dose to the band edge energy \n<inline-formula> <tex-math>$(\\Delta E_{edge})$ </tex-math></inline-formula>\n, thus enabling the channel thickness dependent band structure-based approach to be used to quantify the effect of these radiation-induced traps on the device electrostatics. We show a methodology that co-relates the interface charge induced by \n<inline-formula> <tex-math>$\\Delta E_{edge}$ </tex-math></inline-formula>\n variation and the charge yield, due to different radiating particles, on the \n<inline-formula> <tex-math>$Si-SiO_{2}$ </tex-math></inline-formula>\n interface. After identifying appropriate values of \n<inline-formula> <tex-math>$\\Delta E_{edge}$ </tex-math></inline-formula>\n for different particles and doses, the degradation due to radiation on the channel electrostatics can be accurately simulated, for a wide range of channel thicknesses with the atomistic band structure-based methodology. We also show an approach to extend this methodology to lower device temperatures, thus effectively quantifying the effect of radiation dose on UTB device electrostatics for a wide range of device temperatures.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 2","pages":"225-232"},"PeriodicalIF":2.5000,"publicationDate":"2024-02-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10438719/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The effect of Radiation on the semiconductor-oxide interface, inducing interface trap states, has generally only been experimentally measured, which makes it difficult to quantify the impact of this radiation on device electrostatics. For an Ultra-Thin-Body (UTB) MOS device, the 1-D Band structure along the direction of confinement, if solved self-consistently with the 1-D Poisson’s equation, while varying the band edge energy
$(\Delta E_{edge})$
at the
$Si-SiO_{2}$
interface, can enable the quantification of the effect of interface trap states on channel electrostatics, while also accounting for Quantum Confinement Effects. In this work, we present an approach to correlate the radiation dose to the band edge energy
$(\Delta E_{edge})$
, thus enabling the channel thickness dependent band structure-based approach to be used to quantify the effect of these radiation-induced traps on the device electrostatics. We show a methodology that co-relates the interface charge induced by
$\Delta E_{edge}$
variation and the charge yield, due to different radiating particles, on the
$Si-SiO_{2}$
interface. After identifying appropriate values of
$\Delta E_{edge}$
for different particles and doses, the degradation due to radiation on the channel electrostatics can be accurately simulated, for a wide range of channel thicknesses with the atomistic band structure-based methodology. We also show an approach to extend this methodology to lower device temperatures, thus effectively quantifying the effect of radiation dose on UTB device electrostatics for a wide range of device temperatures.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.