Analysis of Multicrystalline Si Solar Cell Improvement Using Laser-Beam-Induced Current Technique

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Device and Materials Reliability Pub Date : 2024-02-19 DOI:10.1109/TDMR.2024.3367353
T. Takeshita;E. Murakami
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Abstract

The improvement of an mc-Si solar cell through reverse bias and high temperature (BT) aging was investigated using laser beam-induced current (LBIC) and electroluminescence (EL) techniques. We demonstrated that the dark current of the cell decreased with increasing aging time, which led to an increase in the maximum power after BT aging. The improvement in the maximum power was presumed to be due to a reduction in the shunt current in the equivalent circuit model, and we found that the recombination centers in the vicinity of the surface decreased with BT aging. Applying a reverse bias and a high temperature successfully improved the solar cells.
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利用激光束感应电流技术分析多晶矽太阳能电池的改进情况
我们使用激光束诱导电流(LBIC)和电致发光(EL)技术研究了通过反向偏置和高温(BT)老化改善锰硅太阳能电池的问题。我们证明,电池的暗电流随着老化时间的延长而减小,这导致了 BT 老化后最大功率的提高。我们推测最大功率的提高是由于等效电路模型中并联电流的减少,而且我们发现表面附近的重组中心随着 BT 老化而减少。应用反向偏压和高温成功地改善了太阳能电池。
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来源期刊
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability 工程技术-工程:电子与电气
CiteScore
4.80
自引率
5.00%
发文量
71
审稿时长
6-12 weeks
期刊介绍: The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
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