Numerical study on dust particle charging and dynamics in continuous and pulsed radio frequency argon discharges

IF 1.3 4区 物理与天体物理 Q3 PHYSICS, FLUIDS & PLASMAS Contributions to Plasma Physics Pub Date : 2024-02-25 DOI:10.1002/ctpp.202300176
Abdelhak Missaoui, Morad El kaouini, Hassan Chatei
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Abstract

Charging and dynamics of a spherical dust grain injected into a continuous and pulsed radio frequency (RF) discharge have been studied using a one-dimensional fluid model. First, the plasma characteristics of the two types of discharges are computed and compared. In the pulsed discharge, it is found that the central electron density exhibits a periodic variation while the averaged electron density is lower compared to that in the continuous discharge due to the decrease in the total ionization rate. Further, the dust charge is computed using the plasma characteristics. It is found that the dust charge negatively increases as the duty cycle ratio increases. Also, the charge in the pulsed discharge is lower in comparison to the continuous discharge due to the shorter duration of the pulsed RF discharge limiting the amount of energy transferred to electrons. On the other hand, the dust particle remains in the powered sheath region exhibiting a damped oscillation in the two discharges with higher oscillation frequency in the continuous discharge.
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连续和脉冲射频氩放电中尘埃粒子充电和动力学的数值研究
我们利用一维流体模型对注入连续和脉冲射频(RF)放电的球形尘粒的充电和动力学进行了研究。首先,计算并比较了两种放电的等离子体特性。研究发现,在脉冲放电中,中心电子密度呈现周期性变化,而由于总电离率下降,平均电子密度低于连续放电。此外,还利用等离子体特性计算了尘埃电荷。结果发现,随着占空比的增加,尘埃电荷呈负增长。此外,由于脉冲射频放电的持续时间较短,限制了传输给电子的能量,因此脉冲放电中的电荷量低于连续放电。另一方面,尘埃粒子在两次放电中都保持在供电鞘区内,表现出阻尼振荡,而在连续放电中振荡频率较高。
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来源期刊
Contributions to Plasma Physics
Contributions to Plasma Physics 物理-物理:流体与等离子体
CiteScore
2.90
自引率
12.50%
发文量
110
审稿时长
4-8 weeks
期刊介绍: Aims and Scope of Contributions to Plasma Physics: Basic physics of low-temperature plasmas; Strongly correlated non-ideal plasmas; Dusty Plasmas; Plasma discharges - microplasmas, reactive, and atmospheric pressure plasmas; Plasma diagnostics; Plasma-surface interaction; Plasma technology; Plasma medicine.
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