Falko Böttcher, I. Schaarschmidt, J. Edelmann, Andreas Schubert
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引用次数: 0
Abstract
Shape-memory alloys set high demands on the production technologies being used. During cutting, continuous heat input and mechanical stress have an undesirable influence on the shape-memory effect. Pulsed electrochemical machining (PECM), which is based on anodic dissolution, enables force-free machining without thermomechanical influence on the edge-zone properties of the workpiece. Depending on the desired geometry, the development of a customized PECM fixture is necessary. The design of the fixtures is often based on the experiences of the designers and manufacturers, which often results in an estimation of the functionally critical dimensions. For this reason, the study focuses on a methodical approach for evaluating crucial fixture dimensions using knowledge of the specific material dissolution behavior linked with a numerical simulation model. It has been shown that the shape-memory alloy NiMnGa has a non-linear dissolution behavior in sodium nitrate. A reduction of stray currents up to 20% resulting from a lateral gap between the cathode and electrical insulation was demonstrated using numerical simulation. The study shows that a low cathode shaping height has the strongest influence on precise processing. Varying the process parameters allowed for the lateral gap to be adjusted between 0.15 and 0.25 mm.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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Web of Science SCIE
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