A proposed multiphysics comparison of different alloy compositions for electro-thermomechanical reliability analysis

Abstract

Given the tremendous growth of the microelectronics industry in recent years, soldering efficiency is more crucial than ever. Despite the great importance of the solder joints, these interconnections happen to be the weakest link in electronic packaging. Many surveys have been carried out in order to investigate their thermomechanical reliability but still incomplete since the electro-thermomechanical reliability is the one encountered in real operational services. A thorough insight into the multiphysics behavior of Pb-free solder joints is fundamental to enhancing the operational efficiency since the extent of their deterioration is a significant function of their compositions. This article investigates the response of various solder alloys (Sn63Pb37, SAC105, SAC305, SAC405, and InnoLot) to electrothermal loadings. The study explores their performance under different temperature conditions and examines factors such as melting temperature variations, residual stresses, and the impact of the IMC layer. The results highlight the superior reliability of SAC405, particularly regarding inelastic strain and premature damage. The study underscores the significance of mitigating these factors during electronics design and manufacturing to enhance solder joint lifetime. The findings contribute to advancing solder alloy reliability and improving electronic system performance.