Front Cover: Automatic optimal design of field plate for silicon on insulator lateral double-diffused metal oxide semiconductor using simulated annealing algorithm

IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IET Power Electronics Pub Date : 2024-03-12 DOI:10.1049/pel2.12684
Jing Chen, Renji Xia, Jinwen You, Qing Yao, Yuxuan Dai, Jun Zhang, Jiafei Yao, Yufeng Guo
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Abstract

The cover image is based on the Original Research Automatic optimal design of field plate for silicon on insulator lateral double-diffused metal oxide semiconductor using simulated annealing algorithm by Jing Chen et al., https://doi.org/10.1049/pel2.12658.

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封面:利用模拟退火算法自动优化绝缘体硅侧双扩散金属氧化物半导体的场板设计
封面图片基于陈静等人的原创研究《利用模拟退火算法自动优化绝缘体硅侧双扩散金属氧化物半导体场板设计》,https://doi.org/10.1049/pel2.12658。
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来源期刊
IET Power Electronics
IET Power Electronics ENGINEERING, ELECTRICAL & ELECTRONIC-
CiteScore
5.50
自引率
10.00%
发文量
195
审稿时长
5.1 months
期刊介绍: IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes: Applications: Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances. Technologies: Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies. Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials. Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems. Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques. Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material. Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest. Special Issues. Current Call for papers: Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf
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