Pulsed Aerosol-Assisted Low-Pressure Plasma for Thin-Film Deposition

IF 2.6 3区物理与天体物理 Q3 ENGINEERING, CHEMICAL Plasma Chemistry and Plasma Processing Pub Date : 2024-03-12 DOI:10.1007/s11090-024-10455-x

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Abstract

Plasma-enhanced chemical vapor deposition is a well-developed technique that is commonly applied in the preparation of thin films. However, this technique is limited to thermodynamically stable and chemically inert precursor gases or vapors. Recently, pulsed aerosol-assisted plasma processes have emerged as an advantageous alternative that allows for the injection of various liquid solutions in the plasma, regardless of their properties. This study examines the production of thin films by pulsed injection of pentane aerosols into a low-pressure RF capacitively coupled plasma. This technique produces thin films with high material balance and a high degree of control by adjusting the pulsed injection parameters. At the pulse scale, pulsed injection induces a temporary increase in the working pressure, resulting in time-dependent mechanisms that can affect the dynamics of thin-film deposition at the process scale. Overall, the results show a key role of droplets and their kinetics (ballistic transport, vaporization kinetics, electrostatic confinement). Hence, to efficiently apply this method in the preparation of (multi-)functional coatings, the aerosol must be carefully characterized.

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用于薄膜沉积的脉冲气溶胶辅助低压等离子体

摘要等离子体增强化学气相沉积是一种成熟的技术，通常用于制备薄膜。然而，这种技术仅限于热力学稳定和化学惰性的前驱气体或蒸汽。最近，脉冲气溶胶辅助等离子体工艺作为一种有利的替代方法出现了，它允许在等离子体中注入各种液体溶液，而不管其性质如何。本研究探讨了将戊烷气溶胶脉冲注入低压射频电容耦合等离子体生产薄膜的方法。通过调整脉冲注入参数，该技术生产出的薄膜具有很高的材料平衡性和高度可控性。在脉冲尺度上，脉冲注入会导致工作压力暂时增加，从而产生与时间相关的机制，这些机制会影响薄膜沉积过程的动态。总之，研究结果表明液滴及其动力学（弹道传输、汽化动力学、静电约束）起着关键作用。因此，要将这种方法有效地应用于制备（多）功能涂层，必须仔细研究气溶胶的特性。

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来源期刊

Plasma Chemistry and Plasma Processing 工程技术-工程：化工

CiteScore

5.90

自引率

8.30%

发文量

审稿时长

6-12 weeks

期刊介绍： Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.