Semiconductor–Semimetal Composite Engineering Enabling Record-High Thermoelectric Power Density for Low-Temperature Energy Harvesting

IF 18.5 1区 材料科学 Q1 CHEMISTRY, MULTIDISCIPLINARY Advanced Functional Materials Pub Date : 2024-03-19 DOI:10.1002/adfm.202401763
Liangjun Xie, Guyang Peng, Yuxin Sun, Zihang Liu, Fushan Li, Yuke Zhu, Jianbo Zhu, Hao Wu, Nuo Qu, Wenjing Shi, Lei Jiao, Fengkai Guo, Wei Cai, Haijun Wu, Jiehe Sui
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Abstract

Sustained thermoelectric efforts have concentrated on the enhancement of conversion efficiency of power generators, while simultaneously achieving high output power continues to lag. Specifically, the highest output power density of emerging Mg-based modules reported so far is only half of that of commercial Bi2Te3-based, mainly due to the low power factor of MgAgSb. Herein, homogenously distributed MgCuSb in situ nanoprecipitates in the MgAgSb matrix effectively optimized carrier concentration due to the effect of carrier injection from the metal–semiconductor Ohmic contact. As a result, a record-high average power factor of 27.2 µW cm−1 K−2 is obtained in MgCu0.1Ag0.87Sb0.99 composite within the temperature range of 300–550 K, which is much higher than ever reported values of MgAgSb system. Benefiting from the combination of the optimized average power factor of p-leg and low interface resistivity, a fabricated eight-pair MgCu0.1Ag0.87Sb0.99/Mg3.2Bi1.5Sb0.5 module demonstrates an unprecedently high output power density of 2.9 W cm−2 under a temperature difference of 300 K, outperforming all low-temperature advanced thermoelectric modules. Meanwhile, a competitive conversion efficiency of 7.65% is obtained simultaneously. The work significantly advances high-power thermoelectric applications of Mg-based modules in the field of low-temperature sustainable energy harvesting.

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半导体-半金属复合工程为低温能量收集带来创纪录的高热电功率密度
持续的热电努力主要集中在提高发电设备的转换效率上,而同时实现高输出功率的工作仍然滞后。具体而言,迄今报道的新兴镁基模块的最高输出功率密度仅为商用 Bi2Te3 的一半,这主要是由于 MgAgSb 的功率因数较低。在这里,由于金属-半导体欧姆接触的载流子注入效应,在 MgAgSb 基体中均匀分布的 MgCuSb 原位纳米沉淀有效地优化了载流子浓度。因此,在 300-550 K 温度范围内,MgCu0.1Ag0.87Sb0.99 复合材料的平均功率因数达到了 27.2 µW cm-1 K-2,创历史新高,远高于以往报道的 MgAgSb 系统的数值。得益于优化的 p 脚平均功率因数和低界面电阻率的结合,制造出的八对 MgCu0.1Ag0.87Sb0.99/Mg3.2Bi1.5Sb0.5 模块在 300 K 的温差下显示出前所未有的 2.9 W cm-2 输出功率密度,优于所有低温先进热电模块。同时,还获得了 7.65% 的极具竞争力的转换效率。这项工作极大地推动了镁基模块在低温可持续能源采集领域的大功率热电应用。
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来源期刊
Advanced Functional Materials
Advanced Functional Materials 工程技术-材料科学:综合
CiteScore
29.50
自引率
4.20%
发文量
2086
审稿时长
2.1 months
期刊介绍: Firmly established as a top-tier materials science journal, Advanced Functional Materials reports breakthrough research in all aspects of materials science, including nanotechnology, chemistry, physics, and biology every week. Advanced Functional Materials is known for its rapid and fair peer review, quality content, and high impact, making it the first choice of the international materials science community.
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