Assessment of thermographic tools for the validation of physics-based models of an induction sealing process

IF 1.1 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC International Journal of Applied Electromagnetics and Mechanics Pub Date : 2024-02-16 DOI:10.3233/jae-230177
Matteo Giangolini, Giovanni Betti Beneventi, Andrea Babini
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引用次数: 0

Abstract

Measure of temperature dynamics in induction sealing processes is of paramount importance for the validation of physics-based models. In this work, commonly used commercial tools for temperature measurements, such as thermocouples, pyrometers and thermal cameras, are benchmarked for the characterization of the temperature dynamics occurring in multilayer aluminum foil-based packaging material undergoing relatively fast (i.e., ×100 ms) induction heating transients.
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评估热成像工具,以验证感应密封工艺的物理模型
感应密封过程中的温度动态测量对于验证基于物理的模型至关重要。在这项工作中,常用的商业温度测量工具(如热电偶、高温计和热像仪)被用于描述多层铝箔包装材料在相对快速(即 ×100 毫秒)感应加热瞬态下的温度动态特性。
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来源期刊
CiteScore
1.70
自引率
0.00%
发文量
100
审稿时长
4.6 months
期刊介绍: The aim of the International Journal of Applied Electromagnetics and Mechanics is to contribute to intersciences coupling applied electromagnetics, mechanics and materials. The journal also intends to stimulate the further development of current technology in industry. The main subjects covered by the journal are: Physics and mechanics of electromagnetic materials and devices Computational electromagnetics in materials and devices Applications of electromagnetic fields and materials The three interrelated key subjects – electromagnetics, mechanics and materials - include the following aspects: electromagnetic NDE, electromagnetic machines and devices, electromagnetic materials and structures, electromagnetic fluids, magnetoelastic effects and magnetosolid mechanics, magnetic levitations, electromagnetic propulsion, bioelectromagnetics, and inverse problems in electromagnetics. The editorial policy is to combine information and experience from both the latest high technology fields and as well as the well-established technologies within applied electromagnetics.
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