Improvement of MEMS Thermomechanical Actuation Efficiency by Focused Ion Beam-Induced Deposition

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Microelectromechanical Systems Pub Date : 2024-03-22 DOI:10.1109/JMEMS.2024.3377595
Bartosz Pruchnik;Tomasz Piasecki;Ewelina Gacka;Mateus G. Masteghin;David C. Cox;Teodor Gotszalk
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Abstract

In this article, we present a focused ion beam-induced deposition (FIBID) technique to improve the MEMS thermomechanical actuation efficiency by up to 3 orders of magnitude. During experiments, we investigated the thermomechanical actuation performance of silicon on insulator (SOI) cantilevers integrated in 4-sensors based array. The FIBID process was employed to add an extra layer with a different (and homogeneous) thermal expansion coefficient. The FIBID structures were deterministically deposited with the aid of a xenon-plasma focused ion beam (i.e., no stray species in the amorphous carbon pads). This approach enabled the enhancement of actuation efficiency without any changes in structure stiffness. In this way, an increase in the actuation deflection of 2 orders of magnitude was obtained, which was connected with reduction in the structure stiffness pointing to the enhanced force sensitivity.
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通过聚焦离子束诱导沉积提高 MEMS 热机械致动效率
在本文中,我们介绍了一种聚焦离子束诱导沉积(FIBID)技术,可将微机电系统的热机械致动效率提高 3 个数量级。在实验过程中,我们研究了集成在基于 4 传感器阵列中的绝缘体上硅(SOI)悬臂的热机械致动性能。我们采用了 FIBID 工艺来添加具有不同(和均匀)热膨胀系数的额外层。FIBID 结构是借助氙等离子体聚焦离子束确定性沉积的(即无定形碳垫中没有杂散物质)。这种方法能够在不改变结构刚度的情况下提高致动效率。通过这种方法,致动挠度增加了两个数量级,这与结构刚度的降低有关,从而提高了力灵敏度。
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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