A Review: Breakdown Voltage Enhancement of GaN Semiconductors-Based High Electron Mobility Transistors

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Device and Materials Reliability Pub Date : 2024-03-20 DOI:10.1109/TDMR.2024.3379745
Osman Çiçek;Yosef Badali
{"title":"A Review: Breakdown Voltage Enhancement of GaN Semiconductors-Based High Electron Mobility Transistors","authors":"Osman Çiçek;Yosef Badali","doi":"10.1109/TDMR.2024.3379745","DOIUrl":null,"url":null,"abstract":"Gallium Nitride (GaN) based High Electron Mobility Transistors (HEMTs) are regarded as fundamental semiconductor devices for future power electronic applications. Consequently, researchers have directed their efforts toward enhancing critical parameters such as the breakdown voltage \n<inline-formula> <tex-math>$(V_{br})$ </tex-math></inline-formula>\n, cut-off frequency, and operating temperature. Therefore, this review article explores research endeavors concerning the enhancement of \n<inline-formula> <tex-math>$V_{br}$ </tex-math></inline-formula>\n in GaN-based HEMTs. The objective is to gain insights into the key factors influencing \n<inline-formula> <tex-math>$V_{br}$ </tex-math></inline-formula>\n values and to identify the constraints that govern the optimal performance of HEMTs in power devices. Additionally, this review provides an in-depth examination of select studies that introduce novel techniques for improving \n<inline-formula> <tex-math>$V_{br}$ </tex-math></inline-formula>\n values.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 2","pages":"275-286"},"PeriodicalIF":2.5000,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10477272/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

Gallium Nitride (GaN) based High Electron Mobility Transistors (HEMTs) are regarded as fundamental semiconductor devices for future power electronic applications. Consequently, researchers have directed their efforts toward enhancing critical parameters such as the breakdown voltage $(V_{br})$ , cut-off frequency, and operating temperature. Therefore, this review article explores research endeavors concerning the enhancement of $V_{br}$ in GaN-based HEMTs. The objective is to gain insights into the key factors influencing $V_{br}$ values and to identify the constraints that govern the optimal performance of HEMTs in power devices. Additionally, this review provides an in-depth examination of select studies that introduce novel techniques for improving $V_{br}$ values.
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综述:基于氮化镓半导体的高电子迁移率晶体管的击穿电压增强
基于氮化镓(GaN)的高电子迁移率晶体管(HEMT)被视为未来电力电子应用的基础半导体器件。因此,研究人员致力于提高击穿电压 $(V_{br})$、截止频率和工作温度等关键参数。因此,这篇综述文章探讨了有关增强基于氮化镓的 HEMT 中 $V_{br}$ 的研究工作。目的是深入了解影响 $V_{br}$ 值的关键因素,并找出功率器件中 HEMT 最佳性能的制约因素。此外,本综述还深入探讨了引入新技术以提高 V_{br}$ 值的精选研究。
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来源期刊
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability 工程技术-工程:电子与电气
CiteScore
4.80
自引率
5.00%
发文量
71
审稿时长
6-12 weeks
期刊介绍: The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
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