Optimization for Buffer and Splitter Insertion in AQFP Circuits with Local and Group Movement

Bing-Huan Wu, Wai-Kei Mak
{"title":"Optimization for Buffer and Splitter Insertion in AQFP Circuits with Local and Group Movement","authors":"Bing-Huan Wu, Wai-Kei Mak","doi":"10.1145/3626184.3633323","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"31 3","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2024 International Symposium on Physical Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3626184.3633323","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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具有局部和群组移动功能的 AQFP 电路中缓冲器和分路器插入优化
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