Design of Dry Friction Damper to Reduce Vibration Impacts to Circuit Cards at Critical Frequencies

Ihor Kovtun, Andrii Goroshko, Svitlana Petrashchuk
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Abstract

The paper is focused on providing strength and stiffness for circuit cards exposed to vibration at critical frequen - cies. Since the dry friction damping is more effective than viscous damping and in case when application of vis - cous dampers is restricted by electronic package design the dry friction damper is proposed to be embedded to de-sign of enclosure case in order to reduce oscillation amplitudes of circuit cards at critical frequencies. Dry friction damper produces dissipative forces – non-elastic resistance forces due to friction in kinematic pairs undergoing oscillations. The mathematical model has been developed for estimation of maximal dynamic stress and deflec - tion in critical cross-section of circuit card with embedded dry friction damper at critical frequencies. Developed mathematical model specifies minimal limit value for stiffness of dry friction damper, which is used in engineering calculations to determine its geometric parameters. Design of dry friction damper is introduced by semi-elliptical beam with rectangular profile. The effectiveness of dry friction damper to reduce dynamic stress and deflection in circuit cards has been analytically proved and experimentally testified.
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设计干摩擦阻尼器以减少临界频率对电路板的振动影响
本文的重点是为暴露在临界频率振动下的电路板提供强度和刚度。由于干摩擦阻尼比粘滞阻尼更有效,而且当粘滞阻尼器的应用受到电子封装设计的限制时,建议将干摩擦阻尼器嵌入外壳的去设计中,以降低电路卡在临界频率下的振幅。干摩擦阻尼器会产生耗散力--由于运动对在振荡过程中产生摩擦而产生的非弹性阻力。为估算内嵌干摩擦阻尼器的电路卡临界截面在临界频率下的最大动态应力和变形,我们开发了一个数学模型。所开发的数学模型规定了干摩擦阻尼器刚度的最小极限值,用于工程计算以确定其几何参数。干摩擦阻尼器的设计由带有矩形轮廓的半椭圆形梁引入。干摩擦阻尼器在减少电路卡动态应力和挠度方面的有效性已得到分析证明和实验验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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