Dejiang Li, Qiutong Tan, Jiwei Liu, Long Zheng, Chao Hu
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引用次数: 0
Abstract
Offshore assembly and disassembly operations represent a multi-billion-dollar market potential. Collaborative lifting by multiple vessels has emerged as a new operating paradigm for integrated offshore facilities assembly and disassembly. Hence, this paper investigates the hydro-dynamic interaction of dual lifting vessels in collaborative lifting operations. The coupled motions during multi-body operations are simulated using the commercial software SESAM. The feasibility of the numerical model for coupled motions in collaborative lifting is verified by comparing the numerical results of topside motions, vessel motions, and vertical lifting arm loads against experimental measurements. The effects of wave heading and period on the hydrodynamic responses of the topside module, dual lifting vessels, and lifting arms during collaborative operations are studied. Their influence patterns and mechanisms are analysed in detail. The results show that transverse waves and head wave induce significant heave and pitch motions of the topside module and vessels, but the maximum vertical loads on the lifting arms occur in oblique waves. The motion responses of the topside module and vessels increase with longer wave periods under the oblique sea condition, and roll motions are more sensitive to large periods compared to the gradual rise in heave and pitch.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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