Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging

IF 2.5 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Materials Pub Date : 2024-03-29 DOI:10.1007/s11664-024-10970-9

Ze Cui, Qiang Jia, Hongqiang Zhang, Yishu Wang, Limin Ma, Guisheng Zou, Fu Guo

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Abstract

The rapid development of the third-generation semiconductors has posed new requirements and challenges for power electronic packaging. In recent years, the utilization of nano-Ag and Cu sintering has emerged as a promising solution for third-generation semiconductor packaging. Sintered Ag demonstrates remarkable thermal conductivity and exceptional oxidation resistance, while sintered Cu offers economic benefits and superior electromigration resistance compared to sintered Ag. This work reviews the bonding process of Ag and Cu nanoparticles for power electronics packaging, and the shear strength and reliability of sintered joints. The influence of material properties, encompassing particle size, shape, and composition, along with critical sintering parameters such as temperature, pressure, and duration is discussed. Additionally, the pivotal role played by the metallization layer for the sintered bonding process is evaluated. Various reliability test results are summarized and analyzed focusing on their affecting factors. Furthermore, this review explores the broader landscape by delving into the opportunities and challenges posed by sintered Ag and Cu in the realm of power electronic packaging.

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用于电力电子封装的纳米颗粒烧结接头的剪切强度和可靠性综述

第三代半导体的快速发展对电力电子封装提出了新的要求和挑战。近年来，利用纳米银和铜烧结已成为第三代半导体封装的一个有前途的解决方案。烧结银具有卓越的导热性和优异的抗氧化性，而烧结铜与烧结银相比具有经济效益和优越的电迁移性能。本文综述了用于电力电子封装的银和铜纳米颗粒的键合工艺，以及烧结接头的剪切强度和可靠性。材料性能的影响，包括粒度，形状和成分，以及关键的烧结参数，如温度，压力和持续时间进行了讨论。此外，还评价了金属化层在烧结结合过程中所起的关键作用。对各种可靠性试验结果进行了总结和分析，重点分析了其影响因素。此外，本综述探讨了更广阔的前景，深入研究了烧结银和铜在电力电子封装领域的机遇和挑战。

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来源期刊

Journal of Electronic Materials 工程技术-材料科学：综合

CiteScore

4.10

自引率

4.80%

发文量

693

审稿时长

3.8 months

期刊介绍： The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field. A journal of The Minerals, Metals & Materials Society.