A review of drivers and barriers of Digital Twin adoption in building project development processes

IF 4.7 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-03-28 DOI:10.36680/j.itcon.2024.008
Muhammad Farhan Jahangir, Carl Schultz, A. Kamari
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Abstract

Over the past few years, the AECO Industry has undergone a shift toward digital transformation, with a growing trend towards adopting innovative technologies such as Digital Twin (DT). DT offers a wide range of applications throughout the building development process. However, some specific factors impede its widespread adoption in the building industry. This study aims to systematically review the available literature on the building project development process from the perspective of DT, with a particular focus on predictive simulations, i.e., co-sims. The review provides a comprehensive overview of drivers and barriers to DT adoption through an analysis of 147 studies between 2013 and 2023. The research identifies seven external and 41 internal drivers, including efficient project management and monitoring, predictive maintenance, and the collection and visualization of real-time data, all of which contribute to improved decision-making processes and reduced operational expenses. Further, the study identifies nine external and 31 internal barriers that impede the adoption of DT in the building development process. These barriers encompass challenges such as a high initial investment cost, a scarcity of a skilled workforce, difficulties in data interoperability, and resistance to change within the organization. A key outcome of the literature review is having identified the opportunity to exploit technologies developed in the automotive sector that enable a seamless integration of specialized simulator models in building development processes, resulting in collaborative simulations. Thus, we propose the concept of a Building Simulation Identity Card (BSIC) to be pursued in future research that would enable stakeholders to address the challenges of collaboration, cooperation, coordination, and communication by creating a common vocabulary to effectively facilitate the adoption of DT in the building's development process.
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建筑项目开发过程中采用数字孪生的驱动因素和障碍综述
在过去几年中,AECO 行业经历了向数字化转型的转变,采用数字孪生(DT)等创新技术的趋势日益明显。DT 在整个建筑开发过程中有着广泛的应用。然而,一些特定因素阻碍了其在建筑行业的广泛应用。本研究旨在从数字孪生技术的角度系统回顾有关建筑项目开发流程的现有文献,尤其侧重于预测模拟,即协同模拟。通过分析 2013 年至 2023 年间的 147 项研究,该综述全面概述了采用 DT 的驱动因素和障碍。研究确定了 7 个外部驱动因素和 41 个内部驱动因素,包括高效的项目管理和监控、预测性维护以及实时数据的收集和可视化,所有这些都有助于改进决策流程和降低运营成本。此外,研究还发现了阻碍在建筑开发过程中采用 DT 的 9 个外部障碍和 31 个内部障碍。这些障碍包括初始投资成本高、熟练劳动力稀缺、数据互操作性困难以及组织内部抵制变革等挑战。文献综述的一个重要成果是发现了利用汽车行业开发的技术的机会,这些技术能够将专业模拟器模型无缝集成到建筑开发流程中,从而实现协作模拟。因此,我们提出了 "建筑仿真身份证"(BSIC)的概念,并将在未来的研究中加以推广,通过创建通用词汇,有效促进在建筑开发过程中采用 DT,使利益相关者能够应对协作、合作、协调和沟通方面的挑战。
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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