{"title":"Investigation of the Electrical Parameters in a Partially Extended Ge-Source Double-Gate Tunnel Field-Effect Transistor (DG-TFET)","authors":"Omendra Kr Singh, Vaithiyanathan Dhandapani, Baljit Kaur","doi":"10.1007/s11664-024-10997-y","DOIUrl":null,"url":null,"abstract":"<div><p>A partially extended germanium-source double-gate tunnel field-effect transistor (PEGeDG-TFET) utilizes line and point tunneling phenomena to achieve low ambipolar current and high ON-state current. These advantages are accompanied by an exceptionally low OFF-state current (<i>I</i><sub>OFF</sub>) and subthreshold swing with resilience against short-channel effects. However, PEGeDG-TFETs face challenges in terms of large variations in <i>I</i><sub>OFF</sub> and changes in electrical characteristics with temperature due to the change in the bandgap of semiconductor material. In this article, we explore the temperature-associated variations of a PEGeDG-TFET under the influence of interface trap charges (ITCs) for reliability assessment. Results revealed that the Shockley–Read–Hall phenomenon is dominant at lower gate bias voltage, leading to <i>I</i><sub>OFF</sub> degeneration at high temperature. The band-to-band tunneling (BTBT) phenomenon experiences minor variations at higher temperature and gate voltage. Additionally, at high temperature (500 K), it is discovered that the threshold voltage, cut-off frequency, gain–bandwidth product, transconductance–frequency product, intrinsic gain, and transit time decrease, thus limiting the device reliability in the avionics sector where temperatures fall below 410 K with consistent performance of analog/radio-frequency (RF) parameters. This investigation was conducted via simulations on a Silvaco ATLAS simulator considering ITCs and temperature variations.</p></div>","PeriodicalId":626,"journal":{"name":"Journal of Electronic Materials","volume":"53 6","pages":"2999 - 3012"},"PeriodicalIF":2.5000,"publicationDate":"2024-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s11664-024-10997-y","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
A partially extended germanium-source double-gate tunnel field-effect transistor (PEGeDG-TFET) utilizes line and point tunneling phenomena to achieve low ambipolar current and high ON-state current. These advantages are accompanied by an exceptionally low OFF-state current (IOFF) and subthreshold swing with resilience against short-channel effects. However, PEGeDG-TFETs face challenges in terms of large variations in IOFF and changes in electrical characteristics with temperature due to the change in the bandgap of semiconductor material. In this article, we explore the temperature-associated variations of a PEGeDG-TFET under the influence of interface trap charges (ITCs) for reliability assessment. Results revealed that the Shockley–Read–Hall phenomenon is dominant at lower gate bias voltage, leading to IOFF degeneration at high temperature. The band-to-band tunneling (BTBT) phenomenon experiences minor variations at higher temperature and gate voltage. Additionally, at high temperature (500 K), it is discovered that the threshold voltage, cut-off frequency, gain–bandwidth product, transconductance–frequency product, intrinsic gain, and transit time decrease, thus limiting the device reliability in the avionics sector where temperatures fall below 410 K with consistent performance of analog/radio-frequency (RF) parameters. This investigation was conducted via simulations on a Silvaco ATLAS simulator considering ITCs and temperature variations.
期刊介绍:
The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.
Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field.
A journal of The Minerals, Metals & Materials Society.