{"title":"Experimental Investigation of an Incremental Contact Model for Hyperelastic Solids Using an In Situ Optical Interferometric Technique","authors":"Chunyun Jiang, Yanbin Zheng","doi":"10.3390/lubricants12040109","DOIUrl":null,"url":null,"abstract":"The intricacies of rough surface contact are amplified by hyperelastic materials, primarily due to nonlinear enhancement caused by stress concentration. In previous studies, we proposed an incremental contact model for hyperelastic materials based on the tangent modulus and validated it through finite element simulations. This study proceeds with the experimental validation of the model. Initially, four hyperelastic rough surfaces were scanned and stitched together using a white light interferometer to obtain the whole surface topography. Subsequently, in situ optical interferometric techniques precisely measured the actual contact areas between these four samples and quartz glass, establishing the relationship between the load and contact area. Finally, by incorporating the surface topography into the incremental contact model for hyperelastic materials using profile theory, predictions of the relationship between load and contact area were made and compared with the experimental results. Significant agreement was found within nearly 90% of the relative contact area, which validated the model’s efficacy. The importance of this model extends to practical domains, such as wear, sealing, and contact surface safety research.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"19 4","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.3390/lubricants12040109","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The intricacies of rough surface contact are amplified by hyperelastic materials, primarily due to nonlinear enhancement caused by stress concentration. In previous studies, we proposed an incremental contact model for hyperelastic materials based on the tangent modulus and validated it through finite element simulations. This study proceeds with the experimental validation of the model. Initially, four hyperelastic rough surfaces were scanned and stitched together using a white light interferometer to obtain the whole surface topography. Subsequently, in situ optical interferometric techniques precisely measured the actual contact areas between these four samples and quartz glass, establishing the relationship between the load and contact area. Finally, by incorporating the surface topography into the incremental contact model for hyperelastic materials using profile theory, predictions of the relationship between load and contact area were made and compared with the experimental results. Significant agreement was found within nearly 90% of the relative contact area, which validated the model’s efficacy. The importance of this model extends to practical domains, such as wear, sealing, and contact surface safety research.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
Indexed/Abstracted:
Web of Science SCIE
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