Mechanical and Microstructural Characterization of Diffusion-Bonded Copper-Nickel Joint Interface

Abstract

Solid-state diffusion bonding effectively joins dissimilar materials, even with varying metallurgical properties and melting points. In this study, a Cu/Ni joint was produced at a bonding temperature of 950°C for 60 minutes under a vacuum. The microstructural and mechanical properties of the bonding interface were evaluated using scanning electron microscopy (SEM) equipped with energy-dispersive spectroscopy (EDS), microhardness tests, and X-ray diffraction (XRD). It was found that the EDS point scan analysis revealed the formation of a solid solution of Cu-Ni at the bonding interface. Since Cu-Ni exhibit complete solubility with each other, no intermetallic compounds (IMCs) were formed. The microhardness indicated that the bonding interface had a microhardness of 20% and 54% higher than the base metals (BM) of Ni and Cu, respectively.