Recent research advances in hexagonal boron nitride/polymer nanocomposites with isotropic thermal conductivity

Abstract

The rapid advancement of high-performance microelectronic devices highlights the critical need for developing materials with superior thermal conductivity to efficiently dissipate heat in advanced electronics. Hexagonal boron nitride (h-BN) is renowned for its remarkable thermal conductivity, exceptional electrical insulation capabilities and minimal thermal expansion coefficient, making it an ideal nanofiller to augment the thermal conductivity of polymers in heat transfer and dissipation applications. However, the inherent anisotropy in the thermal conductivity of h-BN and its polymer nanocomposites poses a challenge, as it restricts the uniformity of multi-directional heat transfer and dissipation. Over the past decade, significant efforts have been devoted to improving the isotropy of the thermal conductivity of h-BN/polymer nanocomposites. This review provides an overview of h-BN/polymer nanocomposites with isotropic thermal conductivity, beginning with an introduction to the significance of thermal management and the properties of h-BN. It then addresses the challenges faced by h-BN/polymer nanocomposites, highlighting approaches to construct h-BN materials and nanocomposites with isotropic thermal conductivity, along with the mechanisms of thermal conductivity enhancement. Finally, the review discusses challenges and perspectives, outlining deficiencies and potential future developments in the field.