A novel dual-parameter proximity and touch sensor using SiO2 nanoparticles and NaCl with commercial acrylic-based encapsulation

IF 2.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Micro and Nano Engineering Pub Date : 2024-03-08 DOI:10.1016/j.mne.2024.100242
Michelle Cedeño Mata, Ana Coloma Velez, Ramon Bragos, Manuel Dominguez-Pumar, Sandra Bermejo
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Abstract

This study shows the development and analysis of a novel capacity proximity sensor (CPS) based on a sensing layer made up of a mixture of silicon dioxide nanoparticles (SiO2) and sodium chloride (NaCl), and an encapsulation layer based on a commercial acrylic-based varnish. The encapsulated and non-encapsulated proximity sensors were characterised using impedance spectroscopy (IS), revealing that the resulting impedimetric and capacitance responses exhibit different sensitivities and working sensing ranges. The non-encapsulated sensor presents impedimetric and maximum capacitive sensitivities of 0.0775 cm−1 and -0.9831 cm−1, respectively, within a 2–14 cm sensing range. In contrast, the encapsulated CPS shows maximum impedimetric and capacitive sensitivities of 0.3447 cm−1 and −3.349 cm−1, respectively, and an operation sensing range of 0–3 cm. The results show a 75% decrease in the total sensing range that could be attributed to: (i) a reduction of the effective sensing area due to a reduction of the roughness as demonstrated by SEM analysis, (ii) insulation effects limiting the impact of the material under test (MUT) on the charge carriers distribution, and (iii) decreased charge carrier density involved in the sensing process. Despite the reduced operational range, the encapsulation layer maintains the dual-parameter sensing capabilities, preserves the integrity of the sensing layer, and enables its dual functionality as a proximity and touch sensor. The reported comparison between the encapsulated and non-encapsulated CPSs highlights the effects of the encapsulation layer. The encapsulated version introduces a simple, fast, and cost-effective novel approach for developing CPSs that outperforms some reported CPSs in terms of reliability due to its dual-parameter sensing capability and sensitivity.

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使用二氧化硅纳米颗粒和氯化钠以及商用丙烯酸基封装的新型双参数接近和触摸传感器
本研究展示了一种新型电容式近程传感器(CPS)的开发和分析,该传感器的传感层由二氧化硅纳米颗粒(SiO2)和氯化钠(NaCl)的混合物组成,封装层则以商用丙烯酸基清漆为基础。利用阻抗光谱(IS)对封装和非封装接近传感器进行了表征,结果表明,产生的阻抗和电容响应表现出不同的灵敏度和工作感应范围。在 2-14 厘米的感应范围内,非封装传感器的阻抗灵敏度和最大电容灵敏度分别为 0.0775 厘米-1 和 -0.9831 厘米-1。相比之下,封装 CPS 的最大阻抗和电容灵敏度分别为 0.3447 cm-1 和 -3.349 cm-1,工作感应范围为 0-3 厘米。结果表明,总感应范围缩小了 75%,这可能归因于(i) 扫描电子显微镜(SEM)分析表明,粗糙度降低导致有效传感面积减小;(ii) 绝缘效应限制了被测材料(MUT)对电荷载流子分布的影响;(iii) 传感过程中电荷载流子密度降低。尽管工作范围缩小了,但封装层保持了双参数传感能力,保持了传感层的完整性,并实现了其作为接近和触摸传感器的双重功能。报告中对封装型和非封装型 CPS 的比较凸显了封装层的作用。封装版本为开发 CPS 引入了一种简单、快速且具有成本效益的新方法,由于其双参数传感能力和灵敏度,在可靠性方面优于一些已报道的 CPS。
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来源期刊
Micro and Nano Engineering
Micro and Nano Engineering Engineering-Electrical and Electronic Engineering
CiteScore
3.30
自引率
0.00%
发文量
67
审稿时长
80 days
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