With the rapid advances of extreme ultraviolet (EUV) lithography toward ultra-high resolution, characterization technique of EUV resists by interference lithography (IL) for 14-nm node process needs urgent upgrading because of the considerable loss of light transmission by metallic grating masks. Diffraction phase gratings in dielectric silicon dioxide as masks are a promising solution, provided that 28 nm lines/spaces with high aspect ratio as well as large grating areas are obtained. This paper reports our recent success in replicating 28 nm half-pitch gratings with the aspect ratio of 13:1 and the area up to 200 × 200 μm2 by state-of-the-art electron beam lithography with regional proximity effect correction (PEC) in hydrogen silsesquioxane (HSQ) coated on a 100 nm silicon nitride membrane. To ensure well resolved lines/spaces in 350 nm thick HSQ, Monte Carlo algorithm is applied in the simulations of 3D absorbing electron energy density distributions, followed by calculations of equal energy contours of deposited energy based on the kinetic development model, which enables us to work out reliable dose windows. The process developed in this work should be feasibly extended to large area gratings in a future industrialization.
{"title":"Regional proximity effect correction for replicating 28 nm lines/spaces in HSQ as dielectric diffraction gratings with high aspect ratio","authors":"Qingxin Wu , Wentao Yuan , Qiucheng Chen , Hao Quan , Yifang Chen","doi":"10.1016/j.mne.2025.100295","DOIUrl":"10.1016/j.mne.2025.100295","url":null,"abstract":"<div><div>With the rapid advances of extreme ultraviolet (EUV) lithography toward ultra-high resolution, characterization technique of EUV resists by interference lithography (IL) for 14-nm node process needs urgent upgrading because of the considerable loss of light transmission by metallic grating masks. Diffraction phase gratings in dielectric silicon dioxide as masks are a promising solution, provided that 28 nm lines/spaces with high aspect ratio as well as large grating areas are obtained. This paper reports our recent success in replicating 28 nm half-pitch gratings with the aspect ratio of 13:1 and the area up to 200 × 200 μm<sup>2</sup> by state-of-the-art electron beam lithography with regional proximity effect correction (PEC) in hydrogen silsesquioxane (HSQ) coated on a 100 nm silicon nitride membrane. To ensure well resolved lines/spaces in 350 nm thick HSQ, Monte Carlo algorithm is applied in the simulations of 3D absorbing electron energy density distributions, followed by calculations of equal energy contours of deposited energy based on the kinetic development model, which enables us to work out reliable dose windows. The process developed in this work should be feasibly extended to large area gratings in a future industrialization.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"26 ","pages":"Article 100295"},"PeriodicalIF":2.8,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143739189","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The democratization of fabrication equipment has spurred recent interest in maskless grayscale lithography for both 2D and 3D microfabrication. However, the design of suitable template images remains a challenge. This work presents a simplified method for encoding 3D objects into grayscale image files optimized for grayscale lithography. Leveraging the widely used and open-source 3D modeling software Blender, we developed a robust approach to convert geometric heights into grayscale levels and generate image files through top-view rendering. Our method accurately reproduced the overall shape of simple structures like stairs and ramps compared to the original designs. We extended this approach to complex 3D sinusoidal surfaces, achieving similar results. Given the increasing accessibility and user-friendliness of digital rendering tools, this study offers a promising strategy for rapid prototyping of initial designs with minimal effort.
{"title":"Rapid prototyping of 3D microstructures: A simplified grayscale lithography encoding method using blender","authors":"Fabrício Frizera Borghi , Mohammed Bendimerad , Marie-Ly Chapon , Tatiana Petithory , Laurent Vonna , Laurent Pieuchot","doi":"10.1016/j.mne.2024.100294","DOIUrl":"10.1016/j.mne.2024.100294","url":null,"abstract":"<div><div>The democratization of fabrication equipment has spurred recent interest in maskless grayscale lithography for both 2D and 3D microfabrication. However, the design of suitable template images remains a challenge. This work presents a simplified method for encoding 3D objects into grayscale image files optimized for grayscale lithography. Leveraging the widely used and open-source 3D modeling software Blender, we developed a robust approach to convert geometric heights into grayscale levels and generate image files through top-view rendering. Our method accurately reproduced the overall shape of simple structures like stairs and ramps compared to the original designs. We extended this approach to complex 3D sinusoidal surfaces, achieving similar results. Given the increasing accessibility and user-friendliness of digital rendering tools, this study offers a promising strategy for rapid prototyping of initial designs with minimal effort.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"26 ","pages":"Article 100294"},"PeriodicalIF":2.8,"publicationDate":"2024-12-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143148228","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-12-01DOI: 10.1016/j.mne.2024.100293
Fangfang Li , Marina Fetisova , Mervi Koskinen , Jukka Viheriälä , Tapio Niemi , Petri Karvinen , Markku Kuittinen
Quantification of pattern distortion in nanoimprint lithography (NIL) is required when applying it to specific applications, especially those with tight tolerances. We present a systematic study on full wafer NIL distortion using soft stamps made of different carrier foils and UV-curable polymer structure layers. These errors are evaluated by overlay patterning using NIL and optical lithography on 4-in. wafers over a distance of 80 mm. Potential causes for pattern distortion and possible correction methods are discussed in terms of stamp composition and environmental impact. Pattern distortion along axes causing dimensional change is stamp dependent, and stiffer stamps show less pattern dimensional change than the softer ones. In the best case, the minimum variation is 4 parts per million (ppm), and in the worst case, 252 ppm with a softer stamp. Stamp flatness and uniform contact during imprinting are important in reducing high-order pattern distortion. A maximum dimensional variation of 32 ppm in a batch run demonstrates good pattern repeatability. Long-term dimensional stability can be affected by relative humidity, with variations on the order of 100 ppm.
{"title":"Pattern distortion in nanoimprint lithography using UV-curable polymer stamps","authors":"Fangfang Li , Marina Fetisova , Mervi Koskinen , Jukka Viheriälä , Tapio Niemi , Petri Karvinen , Markku Kuittinen","doi":"10.1016/j.mne.2024.100293","DOIUrl":"10.1016/j.mne.2024.100293","url":null,"abstract":"<div><div>Quantification of pattern distortion in nanoimprint lithography (NIL) is required when applying it to specific applications, especially those with tight tolerances. We present a systematic study on full wafer NIL distortion using soft stamps made of different carrier foils and UV-curable polymer structure layers. These errors are evaluated by overlay patterning using NIL and optical lithography on 4-in. wafers over a distance of 80 mm. Potential causes for pattern distortion and possible correction methods are discussed in terms of stamp composition and environmental impact. Pattern distortion along axes causing dimensional change is stamp dependent, and stiffer stamps show less pattern dimensional change than the softer ones. In the best case, the minimum variation is 4 parts per million (ppm), and in the worst case, 252 ppm with a softer stamp. Stamp flatness and uniform contact during imprinting are important in reducing high-order pattern distortion. A maximum dimensional variation of 32 ppm in a batch run demonstrates good pattern repeatability. Long-term dimensional stability can be affected by relative humidity, with variations on the order of 100 ppm.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"25 ","pages":"Article 100293"},"PeriodicalIF":2.8,"publicationDate":"2024-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143166054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-12-01DOI: 10.1016/j.mne.2024.100292
T.M. van den Berg, A. Bosseboeuf, P. Coste, L. Vincent
Hydrogen silsesquioxane (HSQ) and Medusa are spin-on-glasses used for several applications and more specifically for electron-beam lithography. To characterize the thermal densification of these resists on silicon, the mean resist film stress was measured in situ as function of temperature up to 600 °C in a vacuum chamber by the curvature method. The curvature was evaluated from 3D profiles of uncoated and coated dies measured by full field phase shifting interferometry. Three resists were investigated: FOx-15, FOx-25 and Medusa-82. The initial resist stress at room temperature after spin coating and baking is slightly tensile and becomes highly tensile above a certain temperature dependent on the resist. This variation is mainly attributed to resists densification. FOx-15 and FOx-25 start densifying at 500 °C, and FOx-25 densifies more than FOx-15. Medusa-82 is densifying around 300 °C and has the highest tensile stress but the film relaxes beyond 405 °C. In the case of FOx-15, it was found that vacuum annealing prevents densification. Finally, we evaluated the in-plane average coefficient of thermal expansion of the resists from stress measurements during cooling to room temperature. For FOx-15, a CTE equal to 1.5 ppm/K is found, while it is close to 0.0±0.2 ppm/K for FOx-25 and 1.3 ppm/K for Medusa-82.
{"title":"In situ measurements of thermal and pressure dependent stress in SOG films by phase shifting interferometry","authors":"T.M. van den Berg, A. Bosseboeuf, P. Coste, L. Vincent","doi":"10.1016/j.mne.2024.100292","DOIUrl":"10.1016/j.mne.2024.100292","url":null,"abstract":"<div><div>Hydrogen silsesquioxane (HSQ) and Medusa are spin-on-glasses used for several applications and more specifically for electron-beam lithography. To characterize the thermal densification of these resists on silicon, the mean resist film stress was measured in situ as function of temperature up to 600 °C in a vacuum chamber by the curvature method. The curvature was evaluated from 3D profiles of uncoated and coated dies measured by full field phase shifting interferometry. Three resists were investigated: FOx-15, FOx-25 and Medusa-82. The initial resist stress at room temperature after spin coating and baking is slightly tensile and becomes highly tensile above a certain temperature dependent on the resist. This variation is mainly attributed to resists densification. FOx-15 and FOx-25 start densifying at 500 °C, and FOx-25 densifies more than FOx-15. Medusa-82 is densifying around 300 °C and has the highest tensile stress but the film relaxes beyond 405 °C. In the case of FOx-15, it was found that vacuum annealing prevents densification. Finally, we evaluated the in-plane average coefficient of thermal expansion of the resists from stress measurements during cooling to room temperature. For FOx-15, a CTE equal to 1.5 ppm/K is found, while it is close to 0.0±0.2 ppm/K for FOx-25 and 1.3 ppm/K for Medusa-82.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"25 ","pages":"Article 100292"},"PeriodicalIF":2.8,"publicationDate":"2024-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142747231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Our study introduces a novel approach to true random number generation (TRNG) using speckle patterns generated by laser-engraved holograms on carbon fiber-reinforced polymer (CFRP) composite substrates. Unlike previous methods, our approach simplifies the process by generating the necessary image dataset from a single microscope image of the engraved hologram. We achieve a high extraction ratio of 76 %, demonstrating the effectiveness of our TRNG. Moreover, our method successfully passes rigorous statistical tests proposed by the National Institute of Standards and Technology (NIST), indicating its suitability for cryptographic and secure system applications. This work offers promising implications for enhancing security in various domains, from secure communication networks to IoT devices.
{"title":"Laser-engraved holograms as entropy source for random number generators","authors":"Christos Tselios , Anastasios Tsakas , Simone Mazzucato , Christina Politi (Tanya) , Panagiotis Rizomiliotis , Dimitris Alexandropoulos","doi":"10.1016/j.mne.2024.100290","DOIUrl":"10.1016/j.mne.2024.100290","url":null,"abstract":"<div><div>Our study introduces a novel approach to true random number generation (TRNG) using speckle patterns generated by laser-engraved holograms on carbon fiber-reinforced polymer (CFRP) composite substrates. Unlike previous methods, our approach simplifies the process by generating the necessary image dataset from a single microscope image of the engraved hologram. We achieve a high extraction ratio of 76 %, demonstrating the effectiveness of our TRNG. Moreover, our method successfully passes rigorous statistical tests proposed by the National Institute of Standards and Technology (NIST), indicating its suitability for cryptographic and secure system applications. This work offers promising implications for enhancing security in various domains, from secure communication networks to IoT devices.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"25 ","pages":"Article 100290"},"PeriodicalIF":2.8,"publicationDate":"2024-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142661386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-03DOI: 10.1016/j.mne.2024.100291
P. Dani , M. Tuchen , B.E. Meli , J. Franz , J. Knoch
In this work we investigate the release of hydrogen gas from PECVD silicon nitride thin films in the cavities of MEMS based inertial sensors. Firstly, material characterization is conducted on two types of PECVD silicon nitride thin films to study the release of hydrogen gas with analytical methods. The release of hydrogen gas from these materials in encapsulated cavities of MEMS sensors, and its influence on the cavity pressure is also investigated experimentally with the help of functional microchips of MEMS based inertial sensors. Based on our findings and reports from other works, we propose steps by which change in the cavity pressure of the investigated microchip occurs over its different fabrication processes. We suggest that hydrogen gas is released form PECVD silicon nitride thin films at high temperatures during wafer bonding, which can then diffuse in cavities at low pressure over the lifetime of the sensor.
{"title":"Release of hydrogen gas from PECVD silicon nitride thin films in cavities of MEMS sensors","authors":"P. Dani , M. Tuchen , B.E. Meli , J. Franz , J. Knoch","doi":"10.1016/j.mne.2024.100291","DOIUrl":"10.1016/j.mne.2024.100291","url":null,"abstract":"<div><div>In this work we investigate the release of hydrogen gas from PECVD silicon nitride thin films in the cavities of MEMS based inertial sensors. Firstly, material characterization is conducted on two types of PECVD silicon nitride thin films to study the release of hydrogen gas with analytical methods. The release of hydrogen gas from these materials in encapsulated cavities of MEMS sensors, and its influence on the cavity pressure is also investigated experimentally with the help of functional microchips of MEMS based inertial sensors. Based on our findings and reports from other works, we propose steps by which change in the cavity pressure of the investigated microchip occurs over its different fabrication processes. We suggest that hydrogen gas is released form PECVD silicon nitride thin films at high temperatures during wafer bonding, which can then diffuse in cavities at low pressure over the lifetime of the sensor.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"25 ","pages":"Article 100291"},"PeriodicalIF":2.8,"publicationDate":"2024-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142703405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-29DOI: 10.1016/j.mne.2024.100289
Pratik Kusumanchi , Stephan Sylvest Keller , Rasmus Schmidt Davidsen
Photovoltaic retinal implants are emerging as a promising technological solution for restoring vision for patients suffering from retinal degenerative diseases such as retinitis pigmentosa and age-related macular degeneration. These prostheses contain arrays of miniaturized solar cells converting light into electrical output signals, which subsequently are employed for local activation of the intact neuroretina via microelectrodes. Leveraging cutting-edge microfabrication techniques, photovoltaic retinal implants are compact and provide a high density of solar cell pixels. This potentially increases the resolution of the artificial vision and the field of view and lowers the threshold for stimulation of retinal neurons. The introduction of flexible substrates and the integration of 3D electrodes has greatly improved the connection with retinal neurons, optimizing the spatial resolution and potentially lowering the stimulation threshold. This review explores the latest developments in photovoltaic retinal prostheses, highlighting key aspects of their design, fabrication and performance. This field of research is still in its early stage and particular emphasis is laid on promising future research directions including miniaturization of pixels, incorporation of organic flexible semiconductors and first studies considering 3D stimulating electrode structures. Despite the significant progress made, there are still substantial challenges to overcome, such as ensuring long-term biocompatibility and validation of the novel concepts in clinical trials. Ongoing interdisciplinary research and development are essential for moving these promising technologies from the lab to real-world clinical applications, ultimately enhancing vision restoration. This review aims to provide a comprehensive overview of the current state of photovoltaic retinal implants and pinpoints critical areas for future research to further advance this transformative technology.
{"title":"Developments in the design and microfabrication of photovoltaic retinal implants","authors":"Pratik Kusumanchi , Stephan Sylvest Keller , Rasmus Schmidt Davidsen","doi":"10.1016/j.mne.2024.100289","DOIUrl":"10.1016/j.mne.2024.100289","url":null,"abstract":"<div><div>Photovoltaic retinal implants are emerging as a promising technological solution for restoring vision for patients suffering from retinal degenerative diseases such as retinitis pigmentosa and age-related macular degeneration. These prostheses contain arrays of miniaturized solar cells converting light into electrical output signals, which subsequently are employed for local activation of the intact neuroretina via microelectrodes. Leveraging cutting-edge microfabrication techniques, photovoltaic retinal implants are compact and provide a high density of solar cell pixels. This potentially increases the resolution of the artificial vision and the field of view and lowers the threshold for stimulation of retinal neurons. The introduction of flexible substrates and the integration of 3D electrodes has greatly improved the connection with retinal neurons, optimizing the spatial resolution and potentially lowering the stimulation threshold. This review explores the latest developments in photovoltaic retinal prostheses, highlighting key aspects of their design, fabrication and performance. This field of research is still in its early stage and particular emphasis is laid on promising future research directions including miniaturization of pixels, incorporation of organic flexible semiconductors and first studies considering 3D stimulating electrode structures. Despite the significant progress made, there are still substantial challenges to overcome, such as ensuring long-term biocompatibility and validation of the novel concepts in clinical trials. Ongoing interdisciplinary research and development are essential for moving these promising technologies from the lab to real-world clinical applications, ultimately enhancing vision restoration. This review aims to provide a comprehensive overview of the current state of photovoltaic retinal implants and pinpoints critical areas for future research to further advance this transformative technology.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"25 ","pages":"Article 100289"},"PeriodicalIF":2.8,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142573319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-18DOI: 10.1016/j.mne.2024.100288
Arjun Moothedath, Zhong Ren
This study explores the development and characterization of plasma etching for sub-micron features using a nonlinear evolution of parameter in a three-step cyclic Bosch process. Comparing this nonlinear approach with traditional linear parameter evolution, we aimed to address issues such as bowing at the top of the features and narrowing at the bottom. Constant parameter etching produced tapered profiles, undercutting, and non-uniform scallops due to particle deflection. Linear parameter evolution partially mitigated these problems by balancing etch and deposition cycles and gradually increasing radio frequency power, achieving high selectivity to the photoresist. One nonlinear exponential evolution method resulted in a higher etch rate but caused slight damage to the top-side wall, while the etch depth was reduced. The other nonlinear method balanced the etch and deposition steps more effectively, achieving a comparable etch rate and selectivity to the linear method. Further optimization of this second method led to improved vertical profiles and controlled scallops, achieving greater depth, smoother sidewalls, and higher etch rates. This optimized technique successfully fabricated high aspect ratio periodic sub-micron structures with excellent uniformity across the wafer, demonstrating its potential for achieving even higher aspect ratios with thicker masks.
{"title":"Enhanced plasma etching using nonlinear parameter evolution","authors":"Arjun Moothedath, Zhong Ren","doi":"10.1016/j.mne.2024.100288","DOIUrl":"10.1016/j.mne.2024.100288","url":null,"abstract":"<div><div>This study explores the development and characterization of plasma etching for sub-micron features using a nonlinear evolution of parameter in a three-step cyclic Bosch process. Comparing this nonlinear approach with traditional linear parameter evolution, we aimed to address issues such as bowing at the top of the features and narrowing at the bottom. Constant parameter etching produced tapered profiles, undercutting, and non-uniform scallops due to particle deflection. Linear parameter evolution partially mitigated these problems by balancing etch and deposition cycles and gradually increasing radio frequency power, achieving high selectivity to the photoresist. One nonlinear exponential evolution method resulted in a higher etch rate but caused slight damage to the top-side wall, while the etch depth was reduced. The other nonlinear method balanced the etch and deposition steps more effectively, achieving a comparable etch rate and selectivity to the linear method. Further optimization of this second method led to improved vertical profiles and controlled scallops, achieving greater depth, smoother sidewalls, and higher etch rates. This optimized technique successfully fabricated high aspect ratio periodic sub-micron structures with excellent uniformity across the wafer, demonstrating its potential for achieving even higher aspect ratios with thicker masks.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"25 ","pages":"Article 100288"},"PeriodicalIF":2.8,"publicationDate":"2024-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142573318","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-13DOI: 10.1016/j.mne.2024.100287
Carlos Castellano-Aldave , Aitor Plaza , Xabier Iriarte , Alfonso Carlosena
In this paper we describe and fully characterize a novel vibration harvester intended to harness energy from the vibration of a wind turbine (WT), to potentially supply power to sensing nodes oriented to structural health monitoring (SHM). The harvester is based on electromagnetic conversion (EM) and can work with vibrations of ultra-low frequencies in any direction of a plane. The harvester bases on a first prototype already disclosed by the authors, but in this paper, we develop an accurate model parameterized by a combination of physical parameters and others related to the geometry of the device. The model allows predicting not only the power generation capabilities, but also the kinematic behaviour of the harvester. Model parameters are estimated by an identification procedure and validated experimentally. Last, the harvester is tested in real conditions on a wind turbine.
{"title":"Low-frequency electromagnetic harvester for wind turbine vibrations","authors":"Carlos Castellano-Aldave , Aitor Plaza , Xabier Iriarte , Alfonso Carlosena","doi":"10.1016/j.mne.2024.100287","DOIUrl":"10.1016/j.mne.2024.100287","url":null,"abstract":"<div><p>In this paper we describe and fully characterize a novel vibration harvester intended to harness energy from the vibration of a wind turbine (WT), to potentially supply power to sensing nodes oriented to structural health monitoring (SHM). The harvester is based on electromagnetic conversion (EM) and can work with vibrations of ultra-low frequencies in any direction of a plane. The harvester bases on a first prototype already disclosed by the authors, but in this paper, we develop an accurate model parameterized by a combination of physical parameters and others related to the geometry of the device. The model allows predicting not only the power generation capabilities, but also the kinematic behaviour of the harvester. Model parameters are estimated by an identification procedure and validated experimentally. Last, the harvester is tested in real conditions on a wind turbine.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"25 ","pages":"Article 100287"},"PeriodicalIF":2.8,"publicationDate":"2024-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000509/pdfft?md5=2b7b2a9954f6e29b0ae7cf9707532bc9&pid=1-s2.0-S2590007224000509-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142232865","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}